HP 8GB (1x8GB) Dual Rank x4 PC3-10600 (DDR3-1333) Registered CAS-9 Memory
Kit
593913-B21
HP 8GB (1x8GB) Dual Rank x4 PC3L-10600 (DDR3-1333) Registered CAS-9 Low
Power Memory Kit
604502-B21
HP 16GB (1x16GB) Quad Rank x4 PC3-8500 (DDR3-1066) Registered CAS-7
Memory Kit
593915-B21
HP 16GB (1x16GB) Dual Rank x4 PC3L-10600 (DDR3-1333) Registered CAS-9 LP
Memory Kit
627808-B21
HP 32GB (1x32GB) Quad Rank x4 PC3L-8500 (DDR3-1066) Registered CAS-7 LP
Memory Kit
627810-B21
NOTE:
NOTE:
NOTE:
NOTE: All DDR3 memory option kits consist of one DIMM per kit. For detailed
memory configuration rules and guidelines, please use the Online DDR3 Memory
Configuration Tool:
www.hp.com/go/ddr3memory-configurator
NOTE:
NOTE:
NOTE:
NOTE: A minimum of two (2) DIMMs per processor are required.
NOTE:
NOTE:
NOTE:
NOTE: Kits described as PC3L include Low Power DIMMs. For more information on
ProLiant Energy Efficient Features, see:
www.hp.com/go/proliant-energy-efficient
.
NOTE:
NOTE:
NOTE:
NOTE: Each processor memory bus will operate at up to 1333 MHz with either one
quad-rank (QR) or two single-rank/dual-rank (SR/DR) DIMMs per processor memory
channel and 1066 MHz with up to two QR or one QR and one SR/DR DIMMs per
processor memory channel with standard voltage (1.5V, PC3) DIMMs. Memory bus
will operate one speed slower when low voltage (1.35V, PC3L) memory is installed.
Memory bus speeds may be further limited by the speed of the memory used as well.
Step 3: Choose Additional Factory Integration Options
Step 3: Choose Additional Factory Integration Options
Step 3: Choose Additional Factory Integration Options
Step 3: Choose Additional Factory Integration Options
HP Storage Controller
HP Storage Controller
HP Storage Controller
HP Storage Controller
HP Smart Array P410i/1G FBWC 2-ports Int PCIe x8 SAS Controller
NOTE:
NOTE:
NOTE:
NOTE: Includes 1 GB cache with flash-backed write cache (FBWC).
NOTE:
NOTE:
NOTE:
NOTE: The Smart Array P410i controller is required for all blades that support hot
plug drives.
588184-B22
Step 4: Choose Additional Options for Factory Integration
Step 4: Choose Additional Options for Factory Integration
Step 4: Choose Additional Options for Factory Integration
Step 4: Choose Additional Options for Factory Integration
NOTE:
NOTE:
NOTE:
NOTE: For additional "Core Options" and "Additional Options" please see the options sections below. For additional options,
including server blade enclosures interconnect options and power subsystem options; please see the following:
HP BladeSystem c3000 Enclosure QuickSpecs:
http://h18000.www1.hp.com/products/quickspecs/12790_div/12790_div.html
HP BladeSystem c7000 Enclosure QuickSpecs:
http://h18000.www1.hp.com/products/quickspecs/12810_div/12810_div.html
and HP BladeSystem c-Class Interconnect and Mezzanine Components:
http://h18004.www1.hp.com/products/blades/components/c-class-interconnects.html
http://h18004.www1.hp.com/products/blades/components/c-class-adapters.html
QuickSpecs
HP ProLiant BL685c Generation 7 (G7) Server Blade
HP ProLiant BL685c Generation 7 (G7) Server Blade
HP ProLiant BL685c Generation 7 (G7) Server Blade
HP ProLiant BL685c Generation 7 (G7) Server Blade
Configuration Information - Factory Integrated Models
DA - 13655 North America — Version 19 — September 26, 2011
Page 17