refractory ceramic fibers
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
Hexagonal inserted handle box wrench
Diagonal cutting nippers
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Use the tool to separate head and stand.
2. disassemble the cable clip from stand by hand
3. disassemble the base and the column by hand
4. Use tool to release screws
spin off the column..
5. Use tool to release screws, rubbers and plastic base
spin off the base.
6. Use tool to release screws and disassemble the rear cover by hand...
7. Separate PCBA, gaskets and mylar from main chassis by tool or hands..
8. Separate CTRL BD, CTRL BD FFC , Lens and OSD button by tool or hands.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
