EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1
Crossing
Screw Driver
M2
Description #2
Crossing
Screw Driver
M3
Description #3
Crossing
Screw Driver
M4
Description #4
Six corner
sleeve Screw
Driver M3
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Lay the Monitor on the desk, Press the clip button on the Display Head and remove the stand from the Display Head.
and then press the clip button on the arm separate the base from stand
2. Take out the Vesa cover with hand
，
then Unlock the 8 screws which fix the chassis
3. Take out the back cover with hand
4. Take out the keypad cable and backlight cable then separate the bezel with hand
5. Unlock 2 screws which fix the bezel
6. Take out the LVDS connector from Panel then Separate chassis assembly and panel
7. separate the Mylar with hand
8. UUnlock the 2 screws which fix the IF board to the chassis
9. Unlock the 8 screws which fix the IF & Power PCBA then Separate IF & Power PCBA and chassis assembly
10. Take out the LED light
、
the keypad and the LVDS connector from PCBA
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Below action which may easily damage product .please notice it
Lay the
Monitor on
the desk,
Press the
clip button
on the
Display
Head and
remove the
stand from
the Display
Head. and
then press
N/A
