EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at
Item Description
Notes
Quantity of
items
included in
product
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
#1
Plum Screwdriver
T8
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1.
Relax screw to disassembly Base case
2.
Remove screw*2 to disassembly Battery
3.
Remove screw*2 and HDD cable to disassembly HDD assy
4.
Remove screw*2 to disassembly FAN
5.
Remove screw*3 to disassembly Type-C BKT and RJ frame module
6.
Removed Daughter board & FFC & FPC on Top-assy
：
Power, SD, TP module, Finger printer
7.
Remove screw*5 & DC/KB/LCD/Antenna cable to disassembly MB
8.
Remove screw*4 to disassembly LCD module
9.
Disassembly LCD Bezel-assy with LCD Cover-assy
10.
Remove adhesive to disassembly Panel
11.
Remove screw*6 to disassembly hinge
12.
Remove cable: LVDS, Antenna
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).