EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
1.3 Markings for plastic parts greater than 25 grams
Plastic Part Name
Plastic Part
Description
Weight
(grams)
ISO 11469:2000 Plastic Part
Mark
Optional:
Photo
Oak ROW Main Bezel
Main front bezel piece
150
>ABS<
Oak ROW Bezel Frame
Front bezel frame
194
>ABS<
System Fan Frame
Fan Frame
40
>PBT-GF30-FR(17)<
CPU Heatsink Fan
Frame
Fan Frame
28
>PBT-GF30-FR(17)<
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Torx screwdriver
T15
Description #2 Phillips screwdriver
175mm
Description #3 Diagonal cutters (dikes)
165mm
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. SYSTEM BOARD:
(1). Remove the access panel: (a)Remove the one screws that secure the access panel to the computer chassis. (see
Figure 1 below) (b)Pull the Access Panel to rear side and take off the Access Panel. (see Figure 2 below)
(2). Remove the front bezel: (see Figure 3 below) a)
Release the 3 front bezel snaps on the top side of the bezel. b)
Rotate the front bezel and take off.
( 3). Disconnect the power, and data cables from the back of all installed drives.
(4). Disconnect all cables from the system board.
( 5). Remove the heatsink from the system board: (see Figure 4 below) (a)Disconnect the heatsink control cable from the
system board. (b)Loosen the four captive screws that secure the heatsink to the system board. (c)Lift the heatsink from
atop the processor and set it on its side to keep from contaminating the work area with thermal grease.