b.
Remove the heat sink (2) from the system board.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with the
heat sink, processor, and system board spare part kits.
The following illustrations show the replacement thermal material locations.
●
Discrete graphics: Thermal paste is used on the heat sink (1) (3) and associated system board
components (2) (4).
Component replacement procedures
57
Содержание PAVILION Gaming 17-ak000
Страница 1: ...HP 17 Laptop PC AMD Models 17 ak000 17 ak099 Maintenance and Service Guide ...
Страница 4: ...iv Safety warning notice ...
Страница 8: ...viii ...
Страница 32: ...24 Chapter 3 Illustrated parts catalog ...
Страница 42: ...34 Chapter 5 Removal and replacement procedures for Customer Self Repair parts ...
Страница 80: ...72 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts ...
Страница 84: ...76 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts ...
Страница 102: ...94 Chapter 11 Power cord set requirements ...
Страница 104: ...96 Chapter 12 Recycling ...
Страница 108: ...100 Index ...