9.
Remove the heat sink assembly
(4)
by lifting straight up.
Each time the heat sink assembly is removed, the thermal material must be thoroughly cleaned from the
system board at locations
(1)
and
(2)
, from the heat sink assembly at locations
(4)
and
(5)
, and from
the processor
(3)
. Thermal pads and thermal paste must be installed on all surfaces before the heat sink
assembly is reinstalled.
NOTE:
Thermal pads and thermal paste are included with all heat sink assembly, system board, and
processor spare part kits.
The following illustration shows the locations for thermal material on systems with Intel processors.
Each time the heat sink assembly is removed, the thermal material must be thoroughly cleaned from the
system board at locations
(1)
,
(2)
, and
(3)
, from the heat sink assembly at locations
(5)
,
(6)
, and
(7)
,
and from the processor
(4)
. Thermal pads and thermal paste must be installed on all surfaces before
the heat sink assembly is reinstalled.
86
Chapter 4 Removal and replacement procedures
Содержание Pavilion g6-1300
Страница 4: ...iv Safety warning notice ...
Страница 8: ...viii ...
Страница 20: ...Front Component Description Speakers 2 Produce sound 12 Chapter 2 External component identification ...
Страница 27: ...Computer major components Computer major components 19 ...
Страница 72: ...Reverse this procedure to install the power button board 64 Chapter 4 Removal and replacement procedures ...