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EL-MF877-00                                                                                                Page  1 
Template Revision C  

Last revalidation date 09-May-2018 

                 

 

 

 

 

  

HPI instructions for this template are available at 

EL-MF877-01

  

                  

Product End-of-Life Disassembly Instructions 

Product Category: Monitors and Displays

 

Marketing Name / Model 
[List multiple models if applicable.] 

HP Pavilion 32 QHD Display 

Purpose: 

The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the 

disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE). 
 
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the 
plastic part. For any questions on plastic marking, please contact 

HP’s Sustainability Contact

.    

1.0

 

Items Requiring Selective Treatment

 

1.1 Items listed below are classified as requiring selective treatment. 
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. 

Item Description 

Notes 

Quantity of 
items 
included in 
product

 

Printed Circuit Boards (PCB) or Printed Circuit 
Assemblies (PCA) 

With a surface greater than 10 sq cm 

I/F Board*1, Control Board*1, LED Board*1, LED 
Driver Board

 

Batteries, excluding Li-Ion batteries. 

All types including standard alkaline, coin or button style 
batteries   

Li-Ion batteries.  Include all Li-Ion batteries if more than 
one is provided with the product (such as a detachable 
notebook keyboard battery, RTC coin cell, etc.) 

Battery(ies) are attached to the product by (

check all 

that apply with an

 

“x” 

inside the

 

“[ ]”):

 

[          ] screws 
[          ] snaps 
[          ] adhesive 
[          ] other.  Explain            
NOTE: Add detailed removal procedures including 
required tools in the sections 3.1 and 3.2. 

Mercury-containing components 

For example, mercury in lamps, display backlights, 
scanner lamps, switches, batteries             

Liquid Crystal Displays (LCD) with a surface greater than 
100 sq cm 

Includes background illuminated displays with gas 
discharge lamps  panel*1 

Cathode Ray Tubes (CRT) 

            

Capacitors / condensers (Containing PCB/PCT) 

            

Electrolytic Capacitors / Condensers measuring greater 
than 2.5 cm in diameter or height 

 C1 in adapter 

External electrical cables and cords 

 

HDMI cable*1, Power cord*1, Adapter*1

 

Gas Discharge Lamps 

            

Plastics containing Brominated Flame Retardants 
weighing > 25 grams (not including PCBs or PCAs 

 

           

Содержание Pavilion 32 QHD

Страница 1: ... Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm I F Board 1 Control Board 1 LED Board 1 LED Driver Board 4 Batteries excluding Li Ion batteries All types including standard alkaline coin or button style batteries 0 Li Ion batteries Include all Li Ion batteries if more than one is provided with the produc...

Страница 2: ...ad screwdriver 1 Allen screwdriver 1 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure 1 Remove the rubber and screw on the column and hinge then pull out the stand form the monitor head 2 Separate the RC form the monitor head throu...

Страница 3: ...mplex insert a graphic illustration below to identify the items contained in the product that require selective treatment with descriptions and arrows identifying locations 1 Remove the rubber and use the allen screwdriver to unlock the column and hinge then pull out the stand form the monitor head 2 Separate the RC form the monitor head through the tear down slots which on the bottom side ...

Страница 4: ... 2018 HPI instructions for this template are available at EL MF877 01 3 Unlock the back light wire 2 and LVDS 2 from the panel 4 Remove the adhesive tape on the bucket and remove the back light wires from the LED driver board 5 Remove screws 12 on the chassis and bucket ...

Страница 5: ...ation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 6 Disconnect the FFC from the connector And separate the CTRL BD from the holder by hand 7 Unlock 5 screws on the chassis and PCBA And separate PCBAs from the chassis ...

Страница 6: ...e 6 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 8 Disconnect the wire from the interface board 9 Disconnect the LVDS from the interface board ...

Страница 7: ...emplate Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 10 Release the screws on the hinge and bucket 11 Remove the hinge POM 12 Tear the rubber foot from base ...

Страница 8: ...EL MF877 00 Page 8 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 ...

Страница 9: ...EL MF877 00 Page 9 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 13 Separate the base plate and base cover ...

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