HP P274, Инструкция по разборке

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EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
Quantity of
items
included in
product
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. 0
Components and waste containing asbestos 0
Components, parts and materials containing
refractory ceramic fibers 0
Components, parts and materials containing
radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 SCREW DRIVER(PHILLIPS HEAD) #1
Description #2 SCREW DRIVER(PHILLIPS HEAD) #2
Description #3 SCREW DRIVER(HEX HEAD)
Description #4 SPANNER #10
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove Cable From Display Head
2. Remove Stand Base From Display Head
3. Remove Rear Cover From Display Head
4. Remove Adhesive From Display Head
5. Remove Bracket From Display Head
6. Remove Middle Frame From Display Head
7. Middle Frame ASSY Disassembly
8. Rear Cover ASSY Disassembly
9. Bracket ASSY Disassembly
10. Stand ASSY Disassembly
11. Base ASSY Disassembly
12. Panel Module Disassembly
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained
in the product that require selective treatment (with descriptions and arrows identifying locations).