EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
including liquids, semi-liquids (gel/paste) and toner
chambers, and service stations.
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
Disassembly Tool (Better)
Bolt screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Disassemble Stand: Put the monitor on the desk horizontally with soft stuff to protect panel, then separate stand from
monitor as shown.
2. Disassemble Bucket: Remove the bucket screws.
3. Disassemble Bucket: Use disassembling tool to separate back cover from monitor (starting from the disassembiing
hole as shown)
4. Disassemble Panel Assembly: Taking off the LVDS cable and lightbar cable and keypad cable firstly,then separate
bezel and panel
5. Disassemble Bezel Assembly: Use screwdriver to disassemble keypad and take down the spk bar as shown.
6. Disassemble Chassis Assembly: Take down the power board mylar firstly.then use cross /bolt screwdriver
disassembling pi&if board
7. Disassemble Stand Assembly: Press stand arm quick release to disassemble arm and base
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
