EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at
Item Description
Notes
Quantity of
items
included in
product
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. NA
0
Components and waste containing asbestos
NA
0
Components, parts and materials containing refractory
ceramic fibers
NA
0
Components, parts and materials containing
radioactive substances
NA
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description T15 screw driver (Disassemble 2 pcs screws for PCI bkt)
T15 3.0~4.0
kgf-cm
Description T15 screw driver (Disassemble 2 pcs screws for PC board )
T15 3.0~4.0
kgf-cm
Description T15 screw driver (Disassemble 7 pcs screws for MB )
T15 3.0~4.0
kgf-cm
Description T15 screw driver (Disassemble 7 pcs screws for FAN )
T15 3.0~4.0
kgf-cm
Description T15 screw driver (Disassemble 7 pcs screws for PSU )
T15 3.0~4.0
kgf-cm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Push button to remove Panel from housing.
2. Pull off HDD SATA con &HDD power con.
3. Remove HDD from housing
4. Remove front bezel from housing
5.
Loosen 2 screw on main bkt
6.
Remove PCI card from housing
7. Loosen 2 screw on main bkt then remove it
8. Pull off all cables on MB then Loosen 7 screw
9. Loosen 4 screws on bkt then remove Fan module
10. Loosen 4 screws on bkt then remove PSU module
