EL-MF877-00
Page 2
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
Hexagon Screw Driver
Diagonal cutting nippers
Nosed pliers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Use quick release button to separate head and stand.
2. Use tool to release the two screws and disassemble the rear cover by hand.
3. Remove the tape and disassemble the wire.
4. Remove the conductive tape and the screw at the hinge.
5. Remove the yellow tape and disassemble the backlight wire, four LVDS FFC and ambient light board.
6. Separate LVDS FFC and ambient light FFC, remove the AL-mylar, release the screw on PCBs, tear the gaskets,
thermal pad and mylar.
7. Release the screw on mid-frame to remove the deco and panel.
8. Remove the tape and release the screw on rear-cover to remove the ctrl board and audio board, disassemble the RC
lens.
9. Remove two parts LOGO on the rear cover.
10. Remove the lens on the deco and tear the mylar.
11. Remove the screws form column, and separate plastic part.
12. Remove cable clip
13. Remove the screw from hook, and remove hook
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
