a.
Base enclosure (see
)
b.
Battery (see
c.
Speakers (see
).
d.
Optical drive (see
e.
Remove the fans (see
Remove the heat sink:
Following the sequence stamped into the heat sink, loosen the eight Phillips screws (1) and then carefully lift
the heat sink (2) to remove it from the system board.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and the system
board components, it may be necessary to move the heat sink from side to side to detach it.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Thermal paste is used on the processor (1), the
graphics processor (3), and the heat sink sections (2 and 4) that service the processors.
Component replacement procedures
55
Содержание OMEN 17-an100
Страница 1: ...OMEN by HP 17 Laptop PC Maintenance and Service Guide ...
Страница 4: ...iv Important Notice about Customer Self Repair Parts ...
Страница 6: ...vi Processor information ...
Страница 8: ...viii Safety warning notice ...
Страница 12: ...xii ...
Страница 33: ...Computer major components 21 ...