EL-MF877-00 Page 2
Template Revision A
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
Nil
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx driver (standard)
T10, T15 &
T20
Small adjustable wrench
5mm
Wire cutter
Medium
Hexagonal socket
3/16"
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unfasten two captive screws from chassis and remove the Pygmy Module (if Applicable)
2. Unfasten all the screws that are fasten to the top cover with the chassis
3. Remove top cover,then remove the cover of PowerDevice (Aragon-2)
4. Disconnect all the cables.
5. Remove the screws that fasten the grounding lug to the chassis.
6. Remove all the screws that are fasten to the Power device(Aragon-2) and Main PCA in the Chassis base.
7. Unfasten the SCREW LOCK KIT-AMP HD which are used to fasten the EPS/RPS connectors.
8. Remove the Power Device (Aragon-2)
9. Unfasten the two screws from baffle and remove it.
10. Unfasten one screw from the fan tray and remove the fan tray assembly.
11. Unfasten two screws from PCA,Diamond eye and remove it
12. Remove the Light pipe
13. Then,remove the Main PCA.
14. Remove the PowerDevice(Aragon-2) insulator.
15. Disassemble the Front flap from the chassis
16.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
