EL-MF877-00 Page 2
Template Revision A
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx driver
T-10
Nut Driver
3/16”
Wire Cutters
Medium
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove any blank slot cover by disengaging the two retaining screws on each slot cover.
2. Peel off overlay pasted over the installed modules on the right bank of the chassis. Remove metal plate underneath the
overlay by removing mounting screws.
3. Pull out the installed modules. To remove the big heatsink on each module, release spring clip (use a pair of pliers if
necessary) from the two solder anchors, which it is hooked onto. Remove black protective polycarbonate sheet surrounding
the heatsink. Twist and pull the big heatsink out (apply heat if necessary to loosen the heatsink from its fixed position).
4. Remove power supply unit(s)/blank cover at rear of chassis. Refer to power supply product disassembly instruction to
remove components/materials requiring selective treatment in power supplies.
5. Remove backplane PCA by disconnecting the fan tray connector and removing torx mounting screws, then pulling on the
circular pull tab at top of PCA.
6. Remove two bolts on RS-232 connector on front bezel of chassis. Connector is part of Console PCA.
7. Remove console PCA by sliding it to the rear of the chassis.
8. Remove fan tray assembly by removing two torx screws on left side cover (outside) and sliding tray out back of chassis.
Use wire cutters to cut wire harness free. Release push tabs retaining fans and separate from metal frame.
9. Remove plastic side cover by sliding it toward front of chassis to disengage catches.
10. Remove plastic top cover by lifting left edge of cover and simultaneously sliding to left to disengage catches.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
