HP HC241, Инструкция по разборке

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EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
Quantity of
items
included in
product
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above) 0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent
chambers, and service stations. 0
Components and waste containing asbestos 0
Components, parts and materials containing refractory
ceramic fibers 0
Components, parts and materials containing
radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Description #1 SCREW DRIVER(PHILLIPS HEAD)
#0
Description #2 SCREW DRIVER(PHILLIPS HEAD)
#1
Description #3 SCREW DRIVER(PHILLIPS HEAD)
#2
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove External Electric Cables Display Head
2.
Remove Stand base Display Head
3. Remove Rear cover from Display Head
4.
Remove Bracket Assy From Display Head
5.
Remove Front cover Assy From Display Head
6.
Remove Bracket left&right from Display Head
7. Disassemble Front Cover
8. Disassemble Bracket ASSY
9. Disassemble Stand ASSY
10. Disassemble Panel ASSY
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).