HP Engage Flex pro, Инструкция по разборке

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EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Screwdriver T-15
Screwdriver PH1
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the access panel.(see Figure 1 below)
2. Remove the Front panel from chassis.(see Figure 2- 3 below)
3. Disconnect ODD SATA power cable and SATA data cable from ODD.(see Figure 4- 7 below)
4. Remove the ODD from ODD cage.(see Figure 8-9 below)
5. Disconnect HDD SATA power cable and SATA data cable from HDD.(see Figure 10-11 below)
6. Remove the HDD from chassis.(see Figure 12-13 below)
7. Disconnect SATA power/data cable from MB and remove them from the chassis.(see Figure 14-17 below)
8. Disconnect PSU cable from MB.
（
see Figure 18-20 below)
9. Disconnect FIO cable from MB and remove FIO from chassis.(see Figure 21-24 below)
10. Remove PS2&Audio from chassis.(see Figure 25-26 below)
11. Remove the memory from the MB .(see Figure 27 below)
12. Remove speaker from chassis.(see Figure 28-29 below)
13. Remove fan duct from NB.(see Figure 30 below)
14. Remove heatsink from MB.(see Figure 31 below)
15. Remove the CPU from MB.(see Figure 32-33 below)
16. Disconnect fan cable from MB.(see Figure 34 below)
17. Remove the battery from MB.(see Figure 35 below)
18. Remove the MB from chassis.(see Figure 36-38 below)
19. Remove the fan from chassis.(see Figure 39 below)
20. Remove the PSU from chassis.(see Figure 40 below)
21. Separate the fan and fan duct.(see Figure 41-42 below)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).