EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdiver
TORX T15
Philip's head
Phillips 2
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Removed Base Top Cover and Base Front Cover
2. Removed Stand Arm Base and Protect Cover
3. Removed Power LED Cable
4. Remove IO Shielding
5. Removed Motherboard
6. Removed Base Die-casting and Base Bottom Cover
7. Removed Stand Rear Cover, Stand Front Cover
8. Removed Stand Arm
9. Removed Rear Cover
10. Removed Hinge Stand, OSD board
11. Removed Scalar Shielding
12. Removed Scalar Board
13. Removed Camera Box, Camera Transfer Board
14. Removed Camera Module, Camera Bracket , DMIC Board, RGB Camera Box Cable
15. Removed Camera Holder, LCD Frame
16. Removed LCD Chin, LCD Chin Bracket, LCD Panel
17.
18.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Removed Base Top Cover and Base Front Cover
2. Removed Stand Arm Base and Protect Cover
