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2.
Remove the heat sink
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink and
system board components, it may be necessary to move the heat sink from side to side to
detach it.
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the
system board components each time the heat sink is removed. Replacement thermal material is included
with the heat sink and system board spare part kits.
NOTE:
The following illustration shows the replacement thermal material locations. Thermal paste is
used on the processor
(1)
and the heat sink section
(2)
that services it.
Reverse this procedure to install the heat sink.
80
Chapter 4 Removal and replacement procedures
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Содержание Compaq Mini 210
Страница 4: ...iv Safety warning notice Downloaded from LpManual com Manuals ...
Страница 8: ...viii Downloaded from LpManual com Manuals ...
Страница 22: ...3 Illustrated parts catalog 14 Chapter 3 Illustrated parts catalog Downloaded from LpManual com Manuals ...
Страница 24: ...Computer major components 16 Chapter 3 Illustrated parts catalog Downloaded from LpManual com Manuals ...
Страница 86: ...5 Remove the fan 4 78 Chapter 4 Removal and replacement procedures Downloaded from LpManual com Manuals ...