Weight
0.35 oz (10 g)
Dimensions
(Length x
Width x Thickness)
2.01 x 1.18 x 0.18 in (51 x 30 x 4.5 mm)
Voltage, Operating
3.3v +/- 10%
Temperature, Operating
(from TIA/EIA/IS-98-D)
–22° to 140° F (–30° to 60° C) (full RF performance)
–22° to 167° F (–30° to 75° C) (reduced RF performance)
Temperature, Non-
operating, 96 hours
(from
MIL-STD 202 Method 108)
–40° to 185° F (–40° to 85° C)
Humidity, Non-operating
85% relative humidity for 48 hours @ 185° F (85° C) (non-condensing)
Configuration Utilities
Verizon Wireless VZAccess Manager
LED Activity
LED Off – Radio Off;
Solid LED On – Radio On
HP hs2300 HSDPA
Broadband Wireless
Module
Frequency Bands and
Power Class
850/1900/2100MHz WCDMA
Power class 3 (+24dBm)
850MHz GSM/GPRS/EDGE
900MHz GSM/GPRS/EDGE,
1800MHz GSM/GPRS/EDGE
1900MHz GSM/GPRS/EDGE
EDGE E2 power
GPRS/EDGE Multislot Class 12
GPRS PCS/DCS power class 1
GSM power class 4
Wireless Protocol
Standards
GPRS/EDGE: 3GPP R99 GERAN P1
WCDMA Release 5 (R5)
High-Speed Downlink Packet Access (HSDPA) 3.6Mbps
GSM Phase 2+
Wireless Parametric
Standards
Complies with 3GPP specifications
Additional Standards
Compliance
FCC parts 15/22/24, CE, Microsoft WHQL, R&TTE directive 1999/5/EC (health,
safety, EMC, spectrum), GCF-CC (Module), European Union Directive
2002/95/EC (restrictions of the use of certain Hazardous Substances (RoHS) in
electronic equipment), Infrastructure Interoperability Testing (IOT)
Data Rates
(Packet Mode)
Designed maximum data rate:
EDGE 118 kbps UL / 236 kbps DL
UMTS 384 kbps UL / 384 kbps DL
HSDPA 384 kbps UL / 3.6 Mbps DL
Chipset and Module
Qualcomm MSM6280 chipset; Sierra Wireless MC8775 module
Maximum Output Power
32 dBm (+/-2) GSM/EDGE GMSK mode
Power Consumption
(maximum)
800mA
Power Consumption,
Sleep Mode
4 – 8mA
QuickSpecs
HP Compaq 6910p Notebook PC
Technical Specifications
DA - 12699 North America — Version 17 — March 17, 2008
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