MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
T8,T10,PH#1
Tweezers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Use screwdriver (T8) to loosen up the screw on the cover wall plate then, remove the cover wall plate.
2. Use screwdriver (T10) to loosen up 5 screws on the bottom.
3. Remove the top cover by hand and remove the light pipe.
4. Remove Antenna, PCBA, plastic cover plate, and screw using screwdriver (PH#1).
5. Use screwdriver (PH#1) to loosen up 3 screws on the antenna plate, separate Antenna and PCBA.
6. Use screwdriver (PH#1) to loosen 2 screws on the antenna, remove cable and 2 clips
7. Use Tweezers to remove shielding covers and thermal pads.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
