MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at
Tool Description
Tool Size (if
applicable)
Phillips Screwdriver
P2
Diagonal Pliers
5
”
Hexagonal Socket Screwdriver
#5
Plat Screwdriver
4mm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Using a P2 Phillips Screwdriver, remove all 12 screws securing top cover to chassis. Remove Cover. (see 3.2.1)
2.
Using a P2 Phillips Screwdriver, remove 9 screws to chassis, remove Air baffle (3pcs). (see 3.2.2)
3.
Using Diagonal Plier to cut 1 cable tie on chassis and Disconnect Power supply and main board cable connections (3 cables
connections in all), remove Power supply and insulator (1pcs). (see 3.2.3)
4.
Using a P2 Phillips Screwdriver, remove 8 screws to chassis, remove PoE board and insulator (1pcs), remove SFP heat sink,
remove cable tie. (see 3.2.4)
5.
Disconnect Fan and main board 2 cables connection and Using a P2 Phillips Screwdriver, remove 4 screws to chassis, remove
Fan(2pcs) (see 3.2.5)
6.
Using a P2 Phillips Screwdriver, remove 7 screws to chassis, using a #5 Hexagonal socket Screwdriver, remove 7 standoffs to
chassis, remove main board (1pcs). (see 3.2.6)
7.
Using Diagonal Plier to cut 1 cable tie on rear plane, Using Flat Screwdriver push the hooks on the sides of AC-inlet Socket, and
Using a P2 Phillips Screwdriver, remove 1 screws to chassis and Disconnect ac-inlet cable (see 3.2.7)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).
3.2.1