MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Phillips screwdriver #2
M3
Hexagon screwdriver
M3
Phillips screwdriver #1
M3 M2
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the Plastic Protectors cover, and terminal conn.
1. Using a Phillips screwdriver #2, remove the screws attaching the terminal
2. Remove the M4 screws on both sides
1. Using a Phillips screwdriver, remove the screws attaching the M4 screws on both sides 16PCS
3. Remove the top cover
1. Using a Phillips screwdriver #1, remove the screws attaching the top cover side 10pcs.
2. Using a Phillips screwdriver #1, remove the screws attaching the top cover right side 3pcs
3. Using a Phillips screwdriver #1, remove the screws attaching the top cover left side 3pcs
4. Using a Phillips screwdriver #1, remove the screws attaching the top cover back side 5pcs
5. Using a Phillips screwdriver #1, slightly loosen the screws attaching the top cover right side 4pcs
6. Using a Phillips screwdriver #1, slightly loosen the screws attaching the top cover left side 4pcs
7. Using a Phillips screwdriver #2, remove the screws attaching the heat sink top side 4pcs
8. Lift upward to remove cover the chassis. (
heat sink together)
