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EL-MF877-00                                                                                                Page  1 
Template Revision B  

                 

 

 

 

 

  

PSG instructions for this template are available at 

EL-MF877-01

  

  

Product End-of-Life Disassembly Instructions

 

Product Category: Monitors and Displays

 

Marketing Name / Model 
[List multiple models if applicable.] 

HP 24es 23.8-inch Display 

 

 

 

 

Purpose: 

The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions 

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU 
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 

1.0

 

Items Requiring Selective Treatment

 

1.1 Items listed below are classified as requiring selective treatment. 
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as 
applicable. 

Item Description 

Notes 

Quantity 
of items 
included 
in product

 

Printed Circuit Boards (PCB) or Printed Circuit 
Assemblies (PCA) 

With a surface greater than 10 sq cm 
           

Batteries 

All types including standard alkaline and lithium 
coin or button style batteries              

Mercury-containing components 

For example, mercury in lamps, display backlights, 
scanner lamps, switches, batteries             

Liquid Crystal Displays (LCD) with a surface 
greater than 100 sq cm 

Includes background illuminated displays with gas 
discharge lamps             

Cathode Ray Tubes (CRT) 

            

Capacitors / condensers (Containing PCB/PCT) 

            

Electrolytic Capacitors / Condensers measuring 
greater than 2.5 cm in diameter or height 

            

External electrical cables and cords 

            

Gas Discharge Lamps 

            

Plastics containing Brominated Flame Retardants 
weighing > 25 grams (not including PCBs or PCAs 
already listed as a separate item above) 

            

Components and parts containing toner and ink, 
including liquids, semi-liquids (gel/paste) and toner 

Include the cartridges, print heads, tubes, vent 
chambers, and service stations.             

Components and waste containing asbestos 

            

Components, parts and materials containing 
refractory ceramic fibers 

            

Содержание 24es

Страница 1: ... Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm 2 Batteries All types including standard alkaline and lithium coin or button style batteries 0 Mercury containing components For example mercury in lamps display backlights scanner lamps switches batteries 0 Liquid Crystal Displays LCD with a surface greater than 100 sq cm Includes background illumin...

Страница 2: ...ion 4 Description 5 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment 1 Release base stand by pushing a white button then strip screw to separate base and hinge 2 Strip the screws from rear cover so that the rear cover can be removed then remove deco 3 Remove all material under rear cover cont...

Страница 3: ...1 Pull out base and stand a Press white button with one hand b Pull out stand base with another hand 2 Disassy base and stand Step 2 Strip the screws from rear cover then move rear cover follow the below way at last remove Press the white button Twist out the screw ...

Страница 4: ...VDS LED FFCs to separate the base assembly from the unit 3 3 Remove the four screws to separate shielding from CB 3 4 Dismantle the rear cover supporter Remove the screws with Screwdriver Dismantle the rear cover first from the two marked position Remove the 8pin FFC from main board then remove rear cover Remove all tapes Pull out all FFCs connectors and remove screws ...

Страница 5: ...24 07 2012 HP Restricted Page 3 Step 4 Strip the screws 7pcs Remove the nine marked screws to remove rear cover supporter ...

Страница 6: ...24 07 2012 HP Restricted Page 4 Step 5 Release all materials and put some by ESD Can follow the picture as bellow ...

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