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EL-MF877-00                                                                                                Page  2 
Template Revision B  

                 

 

 

 

 

  

PSG instructions for this template are available at 

EL-MF877-01

  

Components, parts and materials containing 
radioactive substances 

            

2.0 Tools Required

 

List the type and size of the tools that would typically be used to disassemble the product to a point where components 
and materials requiring selective treatment can be removed. 

Tool Description 

Tool Size (if 
applicable) 

Description #1 SCREW DRIVER(Plum flower head)   

 

Description #2   screwdriver 

 PH2 

Description #3    

Hex nut screwdriver

 

 M5    

Description #4  

             

Description #5   

            

3.0 Product Disassembly Process

 

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 
 

1. 

Release base stand by pushing a white button then strip screw to separate base and hinge  

2. 

Strip the screws from rear cover so that the rear cover can be removed , then remove deco 

3. 

Remove all material under rear cover contain rear cover supporter 

4. 

Separate main board and shielding  

5. 

Release all materials and put some by ESD 

 
 
3.2 Optional Graphic.  If the disassembly process is complex, insert a graphic illustration below to identify the items 
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

 
 

Содержание 22es

Страница 1: ...t Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm 2 Batteries All types including standard alkaline and lithium coin or button style batteries 0 Mercury containing components For example mercury in lamps display backlights scanner lamps switches batteries 0 Liquid Crystal Displays LCD with a surface greater than 100 sq cm Includes background illumi...

Страница 2: ...ion 4 Description 5 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment 1 Release base stand by pushing a white button then strip screw to separate base and hinge 2 Strip the screws from rear cover so that the rear cover can be removed then remove deco 3 Remove all material under rear cover cont...

Страница 3: ...e stand 1 Pull out base and stand a Press white button with one hand b Pull out stand base with another hand 2 Disassy base and stand Step 2 Strip the screws from rear cover then move rear cover follow the below way Press the white button Twist out the screw ...

Страница 4: ...S LED FFCs to separate the base assembly from the unit 3 3 Remove the four screws to separate shielding from CB 3 4 Dismantle the rear cover supporter Remove the screws with Screwdriver Dismantle the rear cover first from the two marked position Remove the 8pin FFC from main board then remove rear cover Remove all tapes Pull out all FFCs connectors and remove screws ...

Страница 5: ...24 07 2012 HP Restricted Page 3 Step 4 Strip the screws 7pcs Remove the nine marked screws to remove rear cover supporter ...

Страница 6: ...24 07 2012 HP Restricted Page 4 Step 5 Release all materials and put some by ESD Can follow the picture as bellow ...

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