●
Thermal paste is used on the processor (1) and associated heat sink area (2).
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
the system board components each time the heat sink is removed. Replacement thermal material
is included with the heat sink, processor, and system board spare part kits.
Reverse this procedure to reassemble and install the heat sink.
Component replacement procedures
47
Содержание 14s
Страница 4: ...iv Safety warning notice ...
Страница 8: ...viii ...
Страница 14: ...6 Chapter 1 Product description ...
Страница 24: ...16 Chapter 2 Getting to know your computer ...
Страница 32: ...24 Chapter 3 Illustrated parts catalog ...
Страница 62: ...54 Chapter 5 Removal and replacement procedures for Authorized Service Provider parts ...
Страница 74: ...66 Chapter 5 Removal and replacement procedures for Authorized Service Provider parts ...
Страница 82: ...74 Chapter 7 Backing up restoring and recovering ...
Страница 92: ...84 Chapter 10 Power cord set requirements ...
Страница 94: ...86 Chapter 11 Recycling ...
Страница 98: ...90 Index ...