2.
Remove the heat sink assembly
(2)
.
NOTE:
Due to the adhesive quality of the thermal material located between the heat sink
assembly and system board components, it may be necessary to move the heat sink assembly
from side to side to detach the assembly.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink
assembly and the system board each time the heat sink assembly is removed. Thermal paste is
used on the processor
(1)
, the heat sink section
(2)
that services the processor, the Northbridge
chip
(3)
, and the heat sink section
(4)
that services the Northbridge chip. Replacement thermal
material is included with all heat sink assembly and system board spare part kits.
Reverse this procedure to install the heat sink assembly.
52
Chapter 4 Removal and replacement procedures
Содержание 1035nr - Mini - Atom 1.6 GHz
Страница 1: ...HP Mini 1000 Netbook Maintenance and Service Guide ...
Страница 4: ...iv Safety warning notice ...
Страница 8: ...viii ...
Страница 88: ...Where used Two screws that secure the heat sink to the system board 80 Chapter 7 Screw listing ...
Страница 97: ...Where used Four screws that secure the display hinges to the display assembly Phillips PM2 0 4 5 screw 89 ...
Страница 121: ...wireless switch 8 WLAN module removal 43 spare part number 14 21 43 workstation guidelines 28 Index 113 ...
Страница 122: ......