HiSilicon Hi3516C V500, Руководство пользователя

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Hi3516C V500 Demo Board
User Guide
3 Operation Guide
Issue 00B01 (2018-09-04)
HiSilicon Proprietary and Confidential
Copyright © HiSilicon Technologies Co., Ltd.
6
Boot Mode Value Resistor
Connection Remarks
01 SW1.4 is set to 0,
while SW1.3 is
set to 1. Boot from the eMMC.
10 SW1.4 is set to 1,
while SW1.3 is
set to 0.  Fastboot
 Update SPI flash (default)
11 SW1.4 and
SW1.3 are set to
1.

Fastboot

Update eMMC (default)
[SFC_DEVICE_MO
DE:
SFC_BOOT_MODE]
00 SW1.1 is set to 0,
R188 is removed,
and R367 is
soldered. SPI NOR flash. The default
addressing mode is 3-byte mode.
01 SW1.1 is set to 0,
R367 is removed,
and R188 is
soldered. SPI NOR flash. The default
addressing mode is 4-byte mode.
10 SW1.1 is set to 1,
R188 is removed,
and R367 is
soldered. SPI NAND flash. The default
addressing mode is 1-wire boot
mode.
11 SW1.1 is set to 1,
R367 is removed,
and R188 is
soldered. SPI NAND flash. The default
addressing mode is 4-wire boot
mode.
UPDATE_MODE 0 S3 key is pressed
down. Enable update from SDIO0 or
USB.
1 S3 key is not
pressed down. Disable UPDATE_MODE
(default).
3.3 DIP Switch Usage
As shown in Figure 3-1 , the pin1 side of the DIP switch is 1 while the other side is 0 .
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