HF-LPT120G Low Power Wi-Fi Module User Manual
Shanghai High-Flying Electronics Technology Co., Ltd(www.hi-flying.com)
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2.
PACKAGE INFORMATION
2.1.
Recommended Reflow Profile
Figure 4.
Reflow Soldering Profile
Table 11 Reflow Soldering Parameter
Note:
1. Recommend to supply N2 for reflow oven.
2. N2 atmosphere during reflow (O2<300ppm)
2.2.
Device Handling Instruction (Module IC SMT Preparation)
1.
Shelf life in sealed bag: 12 months, at <30
℃
and <60% relative humidity (RH)
2.
After bag is opened, devices that will be re-baked required after last baked with window time
168 hours.
3.
Recommend to oven bake with N2 supplied
4.
Recommend end to reflow oven with N2 supplied
5.
Baked required with 24 hours at 125+-5
℃
before rework process for two modules, one is
new module and two is board with module
6.
Recommend to store at
≦
10% RH with vacuum packing
7.
If SMT process needs twice reflow:
side SMT and reflow
Case 1: Wifi module mounted on top side. Need to bake when bottom side process over 168
hours window time, no need to bake within 168 hours
Case 2: Wifi module mounted on bottom side, follow normal bake rule before process
Note:
Window time means from last bake end to next reflow start that has 168 hours space.
NO.
Item
Temperature (Degree)
Time(Sec)
1
Reflow Time
Time of above 220
35~55 sec
2
Peak-Temp
260 max
