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Lumidigm M-Series M3xx Modules Mechanical Integration Guide, PLT-02217, Rev. A.0 

Page 7 of 28  

December 2014  

or enforce stable placement so that once a finger is placed, subsequent movement is 

minimized for about 150ms.  

 

The actual opening in the ergonomic feature that is in contact with the M3xx sensor 

head should remain rectangular to provide a reliable sealing surface between the 

ergonomic and the sensor head. The sealing surface is shown in the upper right of 

Figure 7 and the dimensions of the sealing area are shown in the upper left portion of 

Figure 7. 

 

The ergonomic feature shown in Figure 2 consists of an elliptical opening designed to 

encourage finger placement such that the core of the fingertip is centered on the 

platen area. In the Figure, the finger approaches from the left and the higher wall on 

the right (sensor back) side is meant to stop additional forward motion, while the 

lower entry wall is meant to insure full finger contact with the sensor platen area. And 

finally the rectangular sealing surface aligns to the M3xx sensor head sealing area. If 

an IP65-rated enclosure is required, an additional gasket would be added between 

the M3xx sensor head and the enclosure ergonomic feature shown. 

 

Care must be taken to place the M3xx sensor head in the enclosure such that the 

platen surface is as close as possible to the enclosure’s external surface. A deep 

depression at this interface may collect water and other contaminants and impede 

finger contact with the platen. If the enclosure will be exposed to rain, enclosure 

features that passively drain the platen surface should be considered. 

 

The final human factor design consideration is environmental. Solar heat gain at the 

platen surface can increase platen temperature to levels to that uncomfortable to 

touch. The sensor platen surface should be shaded by the enclosure from direct 

sunlight through a combination of enclosure features as well as the placement of the 

enclosure itself in the environment. 

Lumidigm has experience designing ergonomic features that promote high biometric 

system performance and should be consulted for this portion of the enclosure design. 

Содержание Lumidigm M Series

Страница 1: ...Lumidigm M Series M3xx Modules Mechanical Integration Guide PLT 02217 Rev A 0 December 2014 hidglobal com Lumidigm...

Страница 2: ...Head Mounting Summary 13 3 4 ECU M30x 14 3 4 1 Connectivity 15 3 5 ECU M31x 16 3 5 1 Connectivity 17 3 5 2 GPIO Controls 18 3 6 ECU to Sensor Connection 19 4 Environmental Considerations 20 4 1 Summa...

Страница 3: ...f HID Global Corporation or its licensors in the U S and other countries Lumidigm is a registered trademark of Lumidigm Inc Revision History Date Description Version 12 16 14 First release as part of...

Страница 4: ...cable Together these three parts constitute the Lumidigm M Series modules The M Series modules are designed to be incorporated into products where a reliable biometric with Real World Performance is r...

Страница 5: ...practical in the platen area such that the fingerprint core is in the center of the platen The enclosure design and placement of the enclosure should allow the fingers to be as flat as possible when...

Страница 6: ...time guiding user finger placement towards the center of the sensor platen An example is shown in Figure 2 Because performance is improved when users correctly place the finger flat on the platen the...

Страница 7: ...n area And finally the rectangular sealing surface aligns to the M3xx sensor head sealing area If an IP65 rated enclosure is required an additional gasket would be added between the M3xx sensor head a...

Страница 8: ...3 below the correct user approach direction is from left to right with the blue light directed towards the right away from the user Figure 3 Presence detection illumination pattern The blue PD LED is...

Страница 9: ...31x product lines use the same sensor head Figure 6 shows a cutaway view of the M3xx sensor head showing the platen area enclosure and an assembly consisting of a PCB with the imager and LEDs and a pl...

Страница 10: ...the M3xx sensor head are shown in Figure 7 and a complete 3D CAD model of both the M3xx sensor head as well as the M30x and M31x ECUs are available from Lumidigm to support design activities Figure 7...

Страница 11: ...stomer mounting The arrangement in Figure 8 consists of 1 a clip attached to the M3xx sensor head mating with its exterior features and 2 screws securing this clip to an example customer enclosure whe...

Страница 12: ...present Note M3xx modules do not ship with a mounting clip 3D CAD models and samples of the clip shown are available from HID Global Figure 9 Example M3xx sensor head retaining clip Once exterior fea...

Страница 13: ...e of a positive stop design using the mounting ring shown in Figure 9 Figure 10 Example mounting detail 3 3 Sensor Head Mounting Summary The features that capture and hold the M3xx sensor head should...

Страница 14: ...f the M30x The ECU is a printed circuit board PCB with components on both sides Wiring for power and I O interfaces are available at connectors perpendicular to the PCB Allowances for wiring need to b...

Страница 15: ...Mating Hirose connector housing p n is DF13 7S 1 25C with 26 30AWG crimp terminal p n DF13 2630SCF J3 1 GND J3 2 N C J3 3 N C J3 4 Program Flag 10 J3 5 Program Flag 11 J3 6 Program Flag 12 J3 7 Progra...

Страница 16: ...tation to the sensor head to allow for proper installation and routing of the flex cable that connects these two components of the M31x The ECU is a printed circuit board PCB with components on both s...

Страница 17: ...both below Figure 14 M31x ECU connector positions Connector Position MH Red MH2 5V USB White MH3 D USB Green MH4 D USB Black MH5 GND USB MH7 GPO 1 through 430 ohm resistor MH8 5VDC MH9 GPO 2 through...

Страница 18: ...and 5V current will flow Note that the forward voltage drop of a red LED 0 7V is not adequate for the output to turn the LED fully off in the HI state an additional diode drop in series is recommende...

Страница 19: ...ble to rotate with respect to the connector In this event power events can disrupt the calibration data or ultimately cause a hardware failure in the sensor head We recommend using hot glue to secure...

Страница 20: ...In this design guide we assume that M3xx specifications are representative of the other enclosure components 4 1 Summary of Environmental Considerations The entire enclosure should be sealed from liqu...

Страница 21: ...rd for placements above waist height The shallow depression and the downward angle also facilitate drainage when the enclosure is exposed to precipitation or cleaned with a water spray Figure 17 Examp...

Страница 22: ...a Background light the combination of the enclosure design and the placement of the enclosure in the environment must prevent exposing the platen to direct sunlight The M3xx can tolerate direct lighti...

Страница 23: ...icient nature of modern electronic systems the amount of power dissipation will only provide 3 C to 6 C rise in internal temperature relative to external temperature If the minimum external operating...

Страница 24: ...water ingress test This is a self certification using a documented test procedure that can be performed either by the manufacturer or a lab hired by the manufacturer The M3xx sensor head is an optical...

Страница 25: ...nter weighting exposure filtering IR out and masking off the non finger areas sensitivity has been minimized Direct sunlight is sunlight that is directly overhead or near perpendicular to the platen s...

Страница 26: ...temperature Condensation can manifest itself in two ways First the enclosure walls can cool to the dew point and cause spot condensation at the cooler contact points Secondly as the air mass temperatu...

Страница 27: ...et to 10 C If the enclosure design approach uses a vent or is vented into a larger air mass such as a building interior the desiccant will be rendered ineffective and a different control strategy woul...

Страница 28: ...hidglobal com...

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