MF877-00
Template Revision A
Page 2
HPE instructions for this template are available at
Item Description
Notes
Quantity
of items
included
in product
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Phillips screwdriver
No. 1
Phillips screwdriver
No. 2
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Unfasten 2 screws to remove the fan module from the chassis.
2.
Unfasten 1 screw to remove the power supply from the chassis.
3.
Open the chassis by removing the screws on the top cover.
4.
Uninstall the front bezel.
5.
Remove the bridge board from the chassis.
6.
Remove the interface board from the chassis.
7.
Remove the main board from the chassis.
8.
Remove the battery from main board
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).