Harman Kardon JBL Bar 2.1 Deep Bass, Руководство по обслуживанию

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Special Information BGA IC & Flat Pack-IC
2. lnstallati
。
n
1. Using desoldering b
阳
id
，
陪
move the solder fr
。
m
the foil of each pin of the flat pack-IC
。
n the CBA
so you臼n ins·恒Ila
阻
placement flat pack-IC more
easily.
2. The "e
”
mark on the flat pack-IC indi
臼
tes pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
。
n the PCB when positioning b「installation. Then
p
阻
solde
「
the fou
「
come陌。f the flat pack-IC. (See
Fig. S-1-8.)
3. Solde
「
all pins of the flat pack-IC. Be sure that
none of the pins have solde
「
b
「
idges.
Example:
Pin 1 of the Flat Pack-IC
is indicated by a
”
·
”
mark.
Fig. S-1-7
P
陪
s
。
Ide「
�
CBA
Fig. S-1-8
Instructions for Handling Semi­
conductors
Electros国tic breakdown of the semi-conducto
陪
may
occu
「
due to a potential dif侮陪nee caused by
electros恒tic cha咱e during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1 MO) that is
properly grounded to
陪
m。，ve any static electricity that
may be cha
「
·ged on the body.
2. Ground for叭lorkbench
Be sure to place a conductive sheet o「copper plate
with proper grounding (1 MO）。n the workbench or
。
ther su『臼ce, whe
陪
the semi-conductors a「e to be
pla臼d. Because the static electricity cha
『
-ge on
clothing will not escape through the body grounding
band, be臼「·eful to avoid c
。
ntacting sem
问。
nducto
陌
with y
。
ur clothing.
<Inc
。
rrect>
J啕
<Correct>
CBA
Conductive Sheet or
Coppe『Plate
7