H3C S5830V2 series, Руководство по установке, Страница: 9 / 63

2
For the temperature and humidity requirements of different switch models, see " Appendix A Chassis
views and technical specifications ."
Cleanliness
Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of
metal components and contact points, especially when indoor relative humidity is low. In the worst
case, electrostatic adsorption can cause communication failure.
Table 1 Dust concentration limit in the equipment room
Substance Concentration limit (particles/m
3
)
Dust ≤ 3 x 10
4
(no visible dust on the tabletop over three days)
NOTE:
Dust diameter ≥ 5 μ m
The equipment room must also meet limits on salts, acids, and sulfides to eliminate corrosion and
premature aging of components, as shown in
Table 2 .
Table 2 Harmful gas limits in the equipment room
Gas Maximum concentration (mg/m
3
)
SO
2
0.2
H
2
S 0.006
NH
3
0.05
Cl
2
0.01
EMI
All electromagnetic interference (EMI) sources, from outside or inside of the switch and application
system, adversely affect the switch in the following ways:
•
A conduction pattern of capacitance coupling.
•
Inductance coupling.
•
Electromagnetic wave radiation.
•
Common impedance (including the grounding system) coupling.
To prevent EMI, use the following guidelines:
•
If AC power is used, use a single-phase three-wire power receptacle with protection earth (PE)
to filter interference from the power grid.
•
Keep the switch far away from radio transmitting stations, radar stations, and high-frequency
devices.
•
Use electromagnetic shielding, for example, shielded interface cables, when necessary.
Laser safety
WARNING!
Do not stare into any fiber port when the switch has power. The laser light emitted from the optical
fiber might hurt your eyes.