H3C RA10, Руководство по установке

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2
Table 1 Temperature and humidity requirements
Temperature Relative humidity
0°C to 45°C (32°F to 113°F) 5% to 90%, noncondensing
Cleanliness
Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of
metal components and contact points, especially when indoor relative humidity is low. In the worst
case, electrostatic adsorption can cause communication failure.
Table 2 Dust concentration limit in the equipment room
Substance Concentration limit (particles/m
3
)
Dust particles
≤ 3 x 10
4
(No visible dust on the tabletop in three days)
NOTE:
Dust diameter ≥ 5 µm
The equipment room must also meet limits on salts, acids, and sulfides to eliminate corrosion and
premature aging of components, as shown in
Table 3 .
Table 3 Harmful gas limits in an equipment room
Gas Maximum concentration (mg/m
3
)
SO
2
0.2
H
2
S 0.006
NH
3
0.05
Cl
2
0.01
Cooling system
To ensure good ventilation, follow these guidelines:
•
Maintain a minimum clearance of 10 cm (3.94 in) around the air inlet and outlet vents.
•
Make sure the installation site has a good ventilation system.
ESD prevention
WARNING!
Check the resistance of the ESD wrist strap for safety. The resistance reading should be in the range
of 1 to 10 megohm (Mohm) between a human body and the ground.
To prevent electrostatic discharge (ESD), follow these guidelines:
•
Make sure the router and the floor are reliably grounded.
•
Take dust-proof measures for the equipment room.
•
Maintain the humidity and temperature levels in the acceptable range.
•
Always wear an ESD wrist strap and an ESD garment when touching a circuit board or
transceiver module.