Hardware Development Guide
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ME3630 mini-PCIE
ME3630 mini-PCIE
3.2
H
EAT
-
DISSIPATION
D
ESIGN
The heat-dissipation design of ME3630 mini-PCIE strictly complies with PCI Express Mini Card Electromechanical Specification
Revision 1.2, October 26 2007. The heat sources are evenly distributed, and the product has a very excellent heat-dissipation design.
To ensure that the product performance is fully played out, it is recommended to design the main board as follows:
Locate the module far away from the switch power and high-speed signal cable as much as possible. Well protect the wiring of
the interference sources.
The antenna, and the coaxial cable connecting the network cable and the antenna, cannot be located close the interference
sources.
Do not locate the module close to devices with large heat dissipation, such as CPU, south bridge, etc. The high temperature will
affect the RF performance.