Hardware Installation
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Product Specifications
CPU
3rd Generation Intel® Xeon® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon®
Silver Processor
10nm technology, CPU TDP up to 270W
NOTE: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket
Per Node:
2 x LGA 4189
Total:
8 x LGA 4189
Socket P+
Chipset
Intel® C621A Express Chipset
Memory
Per Node:
16 x DIMM slots
Total:
64 x DIMM slots
DDR4 memory supported only
8-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
1.2V modules: 3200/2933/2666 MHz
LAN
Per Node:
2 x 10GbE BASE-T LAN ports (1 x Intel® X710-AT2)
1 x Dedicated management port
Total:
8 x 10GbE BASE-T LAN ports (1 x Intel® X710-AT2)
4 x Dedicated management port
*CMC: Chassis Management Controller, to monitor all status of computing nodes
Video
(H262-NO0)
(H262-PC1)
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
NOTE:
We reserve the right to make any changes to the product specifications and product-related
information without prior notice.
Содержание H262-NO0
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