GS65011-EVBEZ
EZDrive
TM
Open Loop Boost Evaluation Board
User’s Guide
_____________________________________________________________________________________________________________________
GSWPT-EVBEZ Rev190621
© 2019 GaN Systems Inc.
www.gansystems.com 16
Please refer to the Evaluation Board/Kit Important Notice on page 15
Thermal Considerations
The EVB includes one GS-065-011-1-L GaN E-HEMT. Although the electrical
performance surpasses that for traditional silicon devices, their relatively smaller size
does magnify the thermal management requirements. The evaluation board is intended
for bench evaluation under low ambient temperature and with convection cooling. The
addition of heat-sinking and forced air cooling can significantly increase the current
rating of these devices, but care must be taken to not exceed the absolute maximum
junction temperature of +150 °C.
Note: The EVB does not include any on-board current or thermal protection.
The thermal performance of the EVB is shown in
and
. Infrared
thermography was performed under the following conditions, with a fan on at room-
ambient temperature:
•
V
IN
= 200V
•
V
OUT
= 400V
•
I
OUT
= 0.5A
•
f
SW
= 250 KHz
Figure 11 •
Thermal imaging with an external fan (T
MAX
= 44.8
˚
C)
