D3081, D3131, D3082 (RX900 S1)
Technical Manual
17
3
Features
3.1
Overview
This section provides an overview of the key characteristics for the baseboard
D3081, the CPU Memory Risers (CPUMEMRs) D3131, and the PCI Riser
(PCIR) D3082.
Processors
●
Up to 8 Intel Xeon® X7500/E7500 series processors (up to 130 W); one
processor per CPUMEMR
●
4 Intel QuickPath Interconnects; up to 6,4 GT/s in each direction
●
Hyper-Threading technology; except X7542 processors
●
Up to 2.0 MB L2 cache and 24 MB L3 cache (Nehalem-EX)
Main memory
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Up to 128 slots for DDR3 memory modules (1333 MHz) with 2 GB, 4 GB,
8 GB, and 16 GB capacity; 16 slots per CPUMEMR
●
4 SMI links per CPU and up to 4 DDR3 DIMM memory modules per SMI link;
memory modules connected to CPU via memory buffer named Millbrook;
Intel® Scalable Memory Interconnect (SMI) link connects CPU and
Millbrook
●
Maximum configuration: 2 TB memory with availability of 16 GB memory
modules
●
Basic configuration: 32 GB memory; 4 CPUMEMRs with 4 memory modules
per CPUMEMR
●
Maximum 32 Gbit/s band width (DDR3)
●
Hardware memory scrubbing
●
Single Device Data Correction (SDDC) function (Chipkill™)
●
Memory interleaving function
●
Memory mirroring function
Содержание CPUMEMR D3131
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