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Freescale Semiconductor MPC8349E PowerQUICC II Pro, Технические характеристики

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MPC8349E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor

75

 

Thermal

T

T

 = thermocouple temperature on top of package (

°

C)

Ψ

JT

 = junction-to-ambient thermal resistance (

°

C/W)

P

D

 = power dissipation in the package (W)

The thermal characterization parameter is measured per the JESD51-2 specification using a 40 gauge type 
T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so 
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the 
thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire 
is placed flat against the package case to avoid measurement errors caused by cooling effects of the 
thermocouple wire.

20.2.4

Heat Sinks and Junction-to-Case Thermal Resistance

Some application environments require a heat sink to provide the necessary thermal management of the 
device. When a heat sink is used, the thermal resistance is expressed as the sum of a junction-to-case 
thermal resistance and a case-to-ambient thermal resistance:

R

θ

JA

 = R

θ

JC

 + R

θ

CA

where:

R

θ

JA

 = junction-to-ambient thermal resistance (

°

C/W)

R

θ

JC

 = junction-to-case thermal resistance (

°

C/W)

R

θ

CA

 = case-to-ambient thermal resistance (

°

C/W)

R

θ

JC

 is device-related and cannot be influenced by the user. The user controls the thermal environment to 

change the case-to-ambient thermal resistance, R

θ

CA

. For instance, the user can change the size of the heat 

sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit 
board, or change the thermal dissipation on the printed-circuit board surrounding the device. 

The thermal performance of devices with heat sinks has been simulated with a few commercially available 
heat sinks. The heat sink choice is determined by the application environment (temperature, air flow, 
adjacent component power dissipation) and the physical space available. Because there is not a standard 
application environment, a standard heat sink is not required.

Table 60

 shows heat sink thermal resistance for TBGA of the MPC8349E.

Table 60. Heat Sink and Thermal Resistance of MPC8349E (TBGA)

Heat Sink Assuming Thermal Grease

Air Flow

35

×

35 mm TBGA

Thermal Resistance

AAVID 30

×

30

×

9.4 mm pin fin 

Natural convection

10

AAVID 30

×

30

×

9.4 mm pin fin 

1 m/s

6.5

AAVID 30

×

30

×

9.4 mm pin fin 

2 m/s

5.6

AAVID 31

×

35

×

23 mm pin fin

Natural convection

8.4

AAVID 31

×

35

×

23 mm pin fin

1 m/s

4.7

AAVID 31

×

35

×

23 mm pin fin

2 m/s

4

Содержание MPC8349E PowerQUICC II Pro

Страница 1: ...ment is accurate for revision 1 1 silicon and earlier For information on revision 3 0 silicon and later versions for orderable part numbers ending in A or B see the MPC8349EA PowerQUICC II Pro Integra...

Страница 2: ...implement Power Architecture technology Double data rate DDR SDRAM memory controller Programmable timing for DDR 1 SDRAM 32 or 64 bit data interface up to 333 MHz data rate Four banks of memory each...

Страница 3: ...Internal 2 Kbyte transmit and 2 Kbyte receive FIFOs per TSEC module MII management interface for control and status Programmable CRC generation and checking Dual PCI interfaces Designed to comply with...

Страница 4: ...6 bits ECB CBC CCM and counter CTR modes ARC four execution unit AFEU Stream cipher compatible with the RC4 algorithm 40 to 128 bit programmable key Message digest execution unit MDEU SHA with 160 or...

Страница 5: ...ree protocol engines on a per chip select basis General purpose chip select machine GPCM Three user programmable machines UPMs Dedicated single data rate SDRAM controller Parity support Default boot R...

Страница 6: ...ng and direct mode Interrupt on completed segment and chain DUART Two 4 wire interfaces RxD TxD RTS CTS Programming model compatible with the original 16450 UART and the PC16550D Serial peripheral int...

Страница 7: ...to GVDD 0 3 V 2 5 DDR DRAM reference MVREF 0 3 to GVDD 0 3 V 2 5 Three speed Ethernet signals LVIN 0 3 to LVDD 0 3 V 4 5 Local bus DUART CLKIN system control and power management I2C and JTAG signals...

Страница 8: ...rating Conditions Characteristic Symbol Recommended Value Unit Notes Core supply voltage VDD 1 2 V 60 mV V 1 PLL supply voltage AVDD 1 2 V 60 mV V 1 DDR DRAM I O supply voltage GVDD 2 5 V 125 mV V Thr...

Страница 9: ...e power supplies are stable there may be a period of time that I O pins are actively driven After the power is stable as long as PORESET is asserted most I O pins are three stated To minimize the time...

Страница 10: ...t TJ 65 Typical2 3 2 Typical power is based on a voltage of VDD 1 2 V a junction temperature of TJ 105 C and a Dhrystone benchmark application 3 Thermal solutions may need to design to a value higher...

Страница 11: ...Hz 64 bits 0 55 W 266 MHz 32 bits 0 5 W 266 MHz 64 bits 0 66 W 300 MHz 32 bits 0 54 W 300 MHz 64 bits 0 7 W 333 MHz 32 bits 0 58 W 333 MHz 64 bits 0 76 W 400 MHz 32 bits 400 MHz 64 bits PCI I O load 3...

Страница 12: ...rrent 0 V VIN OVDD IIN 10 A PCI_SYNC_IN input current 0 V VIN 0 5 V or OVDD 0 5 V VIN OVDD IIN 10 A PCI_SYNC_IN input current 0 5 V VIN OVDD 0 5 V IIN 50 A Table 7 CLKIN AC Timing Specifications Param...

Страница 13: ...0 4 V Notes 1 This table applies for pins PORESET HRESET SRESET and QUIESCE 2 HRESET and SRESET are open drain pins thus VOH is not relevant for those pins Table 9 RESET Initialization Timing Specifi...

Страница 14: ...CFG_CLKIN_DIV See the MPC8349E PowerQUICC II Pro Integrated Host Processor Family Reference Manual 2 tCLKIN is the clock period of the input clock applied to CLKIN It is valid only in PCI host mode Se...

Страница 15: ...MVREF 0 49 GVDD 0 51 GVDD V 2 I O termination voltage VTT MVREF 0 04 MVREF 0 04 V 3 Input high voltage VIH MVREF 0 18 GVDD 0 3 V Input low voltage VIL 0 3 MVREF 0 18 V Output leakage current IOZ 10 1...

Страница 16: ...AC input low voltage VIL MVREF 0 31 V AC input high voltage VIH MVREF 0 31 GVDD 0 3 V MDQS MDQ MECC input skew per byte 333 MHz 266 MHz tDISKEW 750 1125 ps 1 Note 1 Maximum possible skew between a da...

Страница 17: ...the clock control register For the skew measurements referenced for tAOSKEW it is assumed that the clock adjustment is set to align the address command valid with the rising edge of MCK 4 ADDR CMD in...

Страница 18: ...tAOSKEW Measurement Figure 5 provides the AC test load for the DDR bus Figure 5 DDR AC Test Load Table 15 shows the DDR SDRAM measurement conditions Table 15 DDR SDRAM Measurement Conditions Symbol DD...

Страница 19: ...delay numbers will strongly depend on the topology used These delay numbers show the total delay for the address and command to arrive at the DRAM devices The actual delay could be different than the...

Страница 20: ...able 17 DUART DC Electrical Characteristics Parameter Symbol Min Max Unit High level input voltage VIH 2 OVDD 0 3 V Low level input voltage VIL 0 3 0 8 V Input current 0 8 V VIN 2 V IIN 5 A High level...

Страница 21: ...in Section 8 3 Ethernet Management Interface Electrical Characteristics 8 1 1 TSEC DC Electrical Characteristics All GMII MII TBI RGMII and RTBI drivers and receivers comply with the DC parametric att...

Страница 22: ...Unit GTX_CLK clock period tGTX 8 0 ns GTX_CLK duty cycle tGTXH tGTX 43 75 56 25 GTX_CLK to GMII data TXD 7 0 TX_ER TX_EN delay tGTKHDX 0 5 5 0 ns GTX_CLK clock rise time VIL min to VIH max tGTXR 1 0...

Страница 23: ...tGRXF 1 0 ns Note 1 The symbols for timing specifications follow the pattern of t first two letters of functional block signal state reference state for inputs and t first two letters of functional b...

Страница 24: ...XH tMTX 35 65 TX_CLK to MII data TXD 3 0 TX_ER TX_EN delay tMTKHDX 1 5 15 ns TX_CLK data clock rise VIL min to VIH max tMTXR 1 0 4 0 ns TX_CLK data clock fall VIH max to VIL min tMTXF 1 0 4 0 ns Note...

Страница 25: ...4 0 ns RX_CLK clock fall time VIH max to VIL min tMRXF 1 0 4 0 ns Note 1 The symbols for timing specifications follow the pattern of t first two letters of functional block signal state reference stat...

Страница 26: ...LK125 reference clock duty cycle tG125H tG125 45 55 ns Notes 1 The symbols for timing specifications follow the pattern of t first two letters of functional block signal state reference state for inpu...

Страница 27: ...irst two letters of functional block signal state reference state for inputs and t first two letters of functional block reference state signal state for outputs For example tTRDVKH symbolizes TBI rec...

Страница 28: ...125H tG125 47 53 Notes 1 In general the clock reference symbol for this section is based on the symbols RGT to represent RGMII and RTBI timing For example the subscript of tRGT represents the TBI T re...

Страница 29: ...hows the RBMII and RTBI AC timing and multiplexing diagrams Figure 14 RGMII and RTBI AC Timing and Multiplexing Diagrams GTX_CLK tRGT tRGTH tSKRGT TX_CTL TXD 8 5 TXD 7 4 TXD 9 TXERR TXD 4 TXEN TXD 3 0...

Страница 30: ...cal Characteristics Powered at 2 5 V Parameter Symbol Conditions Min Max Unit Supply voltage 2 5 V LVDD 2 37 2 63 V Output high voltage VOH IOH 1 0 mA LVDD Min 2 00 LVDD 0 3 V Output low voltage VOL I...

Страница 31: ...s of functional block signal state reference state for inputs and t first two letters of functional block reference state signal state for outputs For example tMDKHDX symbolizes management data timing...

Страница 32: ...ld to USB clock all inputs tUSIXKH 1 ns 2 5 USB clock to output valid all outputs tUSKHOV 7 ns 2 5 Output hold from USB clock all outputs tUSKHOX 2 ns 2 5 Notes 1 The symbols for timing specifications...

Страница 33: ...10 Freescale Semiconductor 33 USB Figure 16 and Figure 17 provide the AC test load and signals for the USB respectively Figure 16 USB AC Test Load Figure 17 USB Signals Output Z0 50 OVDD 2 RL 50 Outpu...

Страница 34: ...evel output voltage IOL 100 A VOL 0 2 V Table 34 Local Bus General Timing Parameters DLL On Parameter Symbol1 Min Max Unit Notes Local bus cycle time tLBK 7 5 ns 2 Input setup to local bus clock excep...

Страница 35: ...timings are measured at the pin 5 tLBOTOT1 should be used when RCWH LALE is not set and when the load on the LALE output pin is at least 10 pF less than the load on the LAD output pins 6 tLBOTOT2 sho...

Страница 36: ...of LCLK0 for all outputs and for LGTA and LUPWAIT inputs or the rising edge of LCLK0 for all other inputs 3 All signals are measured from OVDD 2 of the rising falling edge of LCLK0 to 0 4 OVDD of the...

Страница 37: ...als LA 27 31 LBCTL LBCKE LOE LSDA10 LSDWE LSDRAS LSDCAS LSDDQM 0 3 tLBKHOV tLBKHOV tLBKHOV LSYNC_IN Input Signals LAD 0 31 LDP 0 3 Output Data Signals LAD 0 31 LDP 0 3 Output Address Signal LAD 0 31 L...

Страница 38: ...PM Mode Input Signal LUPWAIT tLBIXKH2 tLBIVKH2 tLBIVKH1 tLBIXKH1 tLBKHOZ1 T1 T3 Input Signals LAD 0 31 LDP 0 3 UPM Mode Output Signals LCS 0 3 LBS 0 3 LGPL 0 5 GPCM Mode Output Signals LCS 0 3 LWE tLB...

Страница 39: ...igure 23 Local Bus Signals GPCM UPM Signals for LCCR CLKDIV 4 DLL Bypass Mode LCLK UPM Mode Input Signal LUPWAIT tLBIXKH tLBIVKH tLBIVKH tLBIXKH tLBKHOZ T1 T3 UPM Mode Output Signals LCS 0 3 LBS 0 3 L...

Страница 40: ...us Figure 24 Local Bus Signals GPCM UPM Signals for LCCR CLKDIV 4 DLL Enabled LSYNC_IN UPM Mode Input Signal LUPWAIT tLBIXKH2 tLBIVKH2 tLBIVKH1 tLBIXKH1 tLBKHOZ1 T1 T3 Input Signals LAD 0 31 LDP 0 3 U...

Страница 41: ...tics Characteristic Symbol Condition Min Max Unit Input high voltage VIH OVDD 0 3 OVDD 0 3 V Input low voltage VIL 0 3 0 8 V Input current IIN 5 A Output high voltage VOH IOH 8 0 mA 2 4 V Output low v...

Страница 42: ...for inputs and t first two letters of functional block reference state signal state for outputs For example tJTDVKH symbolizes JTAG device timing JT with respect to the time data input signals D reach...

Страница 43: ...s the test access port timing diagram Figure 29 Test Access Port Timing Diagram TRST VM Midpoint Voltage OVDD 2 VM VM tTRST VM Midpoint Voltage OVDD 2 VM VM tJTDVKH tJTDXKH Boundary Data Outputs Bound...

Страница 44: ...IH min to VIL max with a bus capacitance from 10 to 400 pF tI2KLKV 20 0 1 CB 250 ns 2 Pulse width of spikes which must be suppressed by the input filter tI2KHKL 0 50 ns 3 Input current each I O pin in...

Страница 45: ...with respect to the time data input signals D reach the valid state V relative to the tI2C clock reference K going to the high H state or setup time Also tI2SXKL symbolizes I2C timing I2 for the time...

Страница 46: ...provides the PCI AC timing specifications at 66 MHz Table 40 PCI DC Electrical Characteristics Parameter Symbol Test Condition Min Max Unit High level input voltage VIH VOUT VOH min or 2 OVDD 0 3 V Lo...

Страница 47: ...tup and hold time is with respect to the rising edge of PORESET Table 42 PCI AC Timing Specifications at 33 MHz Parameter Symbol1 Min Max Unit Notes Clock to output valid tPCKHOV 11 ns 2 Output hold f...

Страница 48: ...eescale Semiconductor PCI Figure 33 shows the PCI input AC timing diagram Figure 33 PCI Input AC Timing Diagram Figure 34 shows the PCI output AC timing diagram Figure 34 PCI Output AC Timing Diagram...

Страница 49: ...in Max Unit Input high voltage VIH 2 0 OVDD 0 3 V Input low voltage VIL 0 3 0 8 V Input current IIN 5 A Output high voltage VOH IOH 8 0 mA 2 4 V Output low voltage VOL IOL 8 0 mA 0 5 V Output low volt...

Страница 50: ...high voltage VIH 2 0 OVDD 0 3 V Input low voltage VIL 0 3 0 8 V Input current IIN 5 A Output high voltage VOH IOH 8 0 mA 2 4 V Output low voltage VOL IOL 8 0 mA 0 5 V Output low voltage VOL IOL 3 2 mA...

Страница 51: ...VIL 0 3 0 8 V Input current IIN 5 A Output low voltage VOL IOL 8 0 mA 0 5 V 2 Output low voltage VOL IOL 3 2 mA 0 4 V 2 Notes 1 This table applies for pins IRQ 0 7 IRQ_OUT and MCP_OUT 2 IRQ_OUT and M...

Страница 52: ...tNIKHOV 6 ns SPI outputs hold Master mode internal clock delay tNIKHOX 0 5 ns SPI outputs valid Slave mode external clock delay tNEKHOV 8 ns SPI outputs hold Slave mode external clock delay tNEKHOX 2...

Страница 53: ...alling edge is the active edge Figure 36 shows the SPI timings in slave mode external clock Figure 36 SPI AC Timing in Slave Mode External Clock Diagram Figure 37 shows the SPI timings in master mode...

Страница 54: ...ay TBGA See Section 18 1 Package Parameters for the MPC8349E TBGA and Section 18 2 Mechanical Dimensions for the MPC8349E TBGA 18 1 Package Parameters for the MPC8349E TBGA The package parameters are...

Страница 55: ...nclature for the MPC8349E 672 TBGA package Notes 1 All dimensions are in millimeters 2 Dimensions and tolerances per ASME Y14 5M 1994 3 Maximum solder ball diameter measured parallel to datum A 4 Datu...

Страница 56: ...0 J30 M31 P33 T34 I O OVDD PCI1_PAR P32 I O OVDD PCI1_FRAME M32 I O OVDD 5 PCI1_TRDY N29 I O OVDD 5 PCI1_IRDY M34 I O OVDD 5 PCI1_STOP N31 I O OVDD 5 PCI1_DEVSEL N30 I O OVDD 5 PCI1_IDSEL J31 I OVDD P...

Страница 57: ...E5 G2 H6 E4 F3 G4 G3 H1 J2 L6 M6 H2 K6 L2 M4 N2 P4 R2 T4 P6 P3 R1 T2 AB5 AA3 AD6 AE4 AB4 AC2 AD3 AE6 AE3 AG4 AK5 AK4 AE2 AG6 AK3 AK2 AL2 AL1 AM5 AP5 AM2 AN1 AP4 AN5 AJ7 AN7 AM8 AJ9 AP6 AL7 AL9 AN8 I O...

Страница 58: ...OP_IN AP22 I O OVDD LDP 2 AN22 I O OVDD LDP 3 AM22 I O OVDD LA 27 31 AK21 AP23 AN23 AP24 AK22 O OVDD LCS 0 3 AN24 AL23 AP25 AN25 O OVDD LWE 0 3 LSDDQM 0 3 LBS 0 3 AK23 AP26 AL24 AM25 O OVDD LBCTL AN26...

Страница 59: ...GPIO1 10 GTM1_TGATE4 GTM2_TGATE3 F22 I O OVDD GPIO1 11 GTM1_TOUT4 GTM2_TOUT3 E22 I O OVDD USB Port 1 MPH1_D0_ENABLEN DR_D0_ENABLEN A26 I O OVDD MPH1_D1_SER_TXD DR_D1_SER_TXD B26 I O OVDD MPH1_D2_VMO_...

Страница 60: ...D7_DRVVBUS DR_D15_IDPULLUP C31 I O OVDD MPH0_NXT DR_RX_ACTIVE_ID B32 I OVDD MPH0_DIR_DPPULLUP DR_RESET A32 I O OVDD MPH0_STP_SUSPEND DR_TX_READY A33 I O OVDD MPH0_PWRFAULT DR_RX_VALIDH C32 I OVDD MPH0...

Страница 61: ...TSEC1_TX_EN B9 O LVDD1 TSEC1_TX_ER GPIO2 31 A16 I O OVDD Three Speed Ethernet Controller Gigabit Ethernet 2 TSEC2_COL GPIO1 21 C14 I O OVDD TSEC2_CRS GPIO1 22 D6 I O LVDD2 TSEC2_GTX_CLK A4 O LVDD2 TS...

Страница 62: ...AM30 O OVDD I2 C interface IIC1_SDA AK29 I O OVDD 2 IIC1_SCL AP32 I O OVDD 2 IIC2_SDA AN31 I O OVDD 2 IIC2_SCL AM31 I O OVDD 2 SPI SPIMOSI AN32 I O OVDD SPIMISO AP33 I O OVDD SPICLK AK30 I O OVDD SPI...

Страница 63: ...J13 Power for LBIU DLL 1 2 V AVDD4 GND A1 A34 C1 C7 C10 C11 C15 C23 C25 C28 D1 D8 D20 D30 E7 E13 E15 E17 E18 E21 E23 E25 E32 F6 F19 F27 F30 F34 G31 H5 J4 J34 K30 L5 M2 M5 M30 M33 N3 N5 P30 R5 R32 T5 T...

Страница 64: ...29 AL30 AM20 AM23 AM24 AM26 AM28 AN11 AN13 PCI 10 100 Ethernet and other standard 3 3 V OVDD MVREF1 M3 I DDR reference voltage MVREF2 AD2 I DDR reference voltage Notes 1 This pin is an open drain sign...

Страница 65: ...parameters select whether CLKIN or CLKIN 2 is driven out on the PCI_CLK_OUTn signals PCI_SYNC_OUT is connected externally to PCI_SYNC_IN to allow the internal clock subsystem to synchronize to the sy...

Страница 66: ...rmation on the clock subsystem The internal ddr_clk frequency is determined by the following equation ddr_clk csb_clk 1 RCWL DDRCM ddr_clk is not the external memory bus frequency ddr_clk passes throu...

Страница 67: ...g frequency of the security core and USB modules does not exceed the respective values listed in this table 400 MHz 533 MHz 667 MHz Unit e300 core frequency core_clk 266 400 266 533 266 667 MHz Cohere...

Страница 68: ...and the CFG_CLKIN_DIV configuration input signal select the ratio between the primary clock input CLKIN or PCI_CLK and the internal coherent system bus clock csb_clk Table 55 and Table 56 show the ex...

Страница 69: ...in agent mode Input Clock Frequency MHz 2 16 67 25 33 33 66 67 csb_clk Frequency MHz Low 0010 2 1 133 Low 0011 3 1 100 200 Low 0100 4 1 100 133 266 Low 0101 5 1 125 166 333 Low 0110 6 1 100 150 200 Lo...

Страница 70: ...if set high SPMF csb_clk Input Clock Ratio2 2 CLKIN is the input clock in host mode PCI_CLK is the input clock in agent mode Input Clock Frequency MHz 2 16 67 25 33 33 66 67 csb_clk Frequency MHz Low...

Страница 71: ...k csb_clk Ratio VCO Divider1 1 Core VCO frequency core frequency VCO divider The VCO divider must be set properly so that the core VCO frequency is in the range of 800 1800 MHz 0 1 2 5 6 nn 0000 n PLL...

Страница 72: ...33 200 400 33 200 400 33 200 400 624 0110 0100100 33 200 400 33 200 400 33 200 400 803 1000 0000011 33 266 400 33 266 400 33 266 400 823 1000 0100011 33 266 400 33 266 400 33 266 400 903 1001 0000011...

Страница 73: ...2s2p R JMA 8 C W 1 3 Junction to ambient 2 m s on single layer board 1s R JMA 9 C W 1 3 Junction to ambient 2 m s on four layer board 2s2p R JMA 7 C W 1 3 Junction to board thermal R JB 3 8 C W 4 Junc...

Страница 74: ...ies widely within the application For many natural convection and especially closed box applications the board temperature at the perimeter edge of the package is approximately the same as the local a...

Страница 75: ...ient thermal resistance C W R JC junction to case thermal resistance C W R CA case to ambient thermal resistance C W R JC is device related and cannot be influenced by the user The user controls the t...

Страница 76: ...h 408 567 8082 473 Sapena Ct 12 Santa Clara CA 95054 Internet www alphanovatech com International Electronic Research Corporation IERC 818 842 7277 413 North Moss St Burbank CA 91502 Internet www ctsc...

Страница 77: ...orces that can lift the edge of the package or peel the package from the board Such peeling forces reduce the solder joint lifetime of the package The recommended maximum force on the top of the packa...

Страница 78: ...ed Host Processor Hardware Specifications Rev 10 78 Freescale Semiconductor Thermal TJ TC R JC PD where TJ junction temperature C TC case temperature of the package C R JC junction to case thermal res...

Страница 79: ...ages are derived directly from VDD through a low frequency filter scheme There are a number of ways to provide power reliably to the PLLs but the recommended solution is to provide five independent fi...

Страница 80: ...the smaller chip capacitors These bulk capacitors should have a low ESR equivalent series resistance rating to ensure the quick response time They should also be connected to the power and ground pla...

Страница 81: ...nal OVDD 105 C 21 6 Configuration Pin Multiplexing The MPC8349E power on configuration options can be set through external pull up or pull down resistors of 4 7 k on certain output pins see the custom...

Страница 82: ...of signal quality or speed for the output pins 21 7 Pull Up Resistor Requirements The MPC8349E requires high resistance pull up resistors 10 k is recommended on open drain pins including I2 C pins the...

Страница 83: ...TBGA parts for silicon Rev 1 x In Figure 42 JTAG Interface Connection updated with new figure In Section 23 Ordering Information replicated note from introduction In Section 23 1 Part Numbers Fully A...

Страница 84: ...11 to 10 Changed classification of document to Technical Data 4 9 2005 Added Table 2 MPC8349E Typical I O Power Dissipation 3 8 2005 Table 1 Updated values for power dissipation that were TBD in Revi...

Страница 85: ...ts including extended temperatures refer to the MPC8349E product summary page on our website listed on the back cover of this document or contact your local Freescale sales office Table 64 shows the S...

Страница 86: ...ation 23 2 Part Marking Parts are marked as in the example shown in Figure 42 Figure 42 Freescale Part Marking for TBGA Devices MPCnnnnetppaaar core platform MHZ ATWLYYWW CCCCC TBGA MMMMM YWWLAZ Notes...

Страница 87: ...MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications Rev 10 Freescale Semiconductor 87 Ordering Information THIS PAGE INTENTIONALLY LEFT BLANK...

Страница 88: ...rectly or indirectly any claim of personal injury or death associated with such unintended or unauthorized use even if such claim alleges that Freescale Semiconductor was negligent regarding the desig...

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