Freescale Semiconductor MPC8260-TCOM, Руководство пользователя

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PRELIMINARY MPC8260TCOM User’s Manual
GENERAL INFORMATION
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CHAPTER 1 - GENERAL INFORMATION
1•1 INTRODUCTION
This manual provides general information, preparation for use and installation instructions, operating
instructions, functional description, and support information for the MPC8260TCOM board.
1•2 FEATURES
The main features of the MPC8260TCOM board are as follows:
• Two Fast Ethernet channels connected guilelessly to the Level One LXT970 device.
• The 2 Fast-Ethernet use FCC1 and FCC3.
• Each one of the Fast - Ethernet module can be disable/disable and controlled by SW.
• Two DS3 channels using the TRAN-SWITCH TXC-03401 FRAMER and TRAN-SWITCH TXC-
20153G DS3 Line Interface Module.
• Each one of the DS3 framer controlled via the MPC8260.
• The 2XDS3 use the TDMA1(DS3_1 FCC2) and TDMA2 (DS3_2 FCC3).
• Each one of the DS3 module can be disable/enable by HW.
• Eight T1 interfaces using MCC1 and MCC2.
• The 8 x T1 use the TOCTL PM4388 as a framer and 2 x PM4314 as a line interface module, both
controlled by the MPC8260.
• Each one of the eight T1 can be independently configured, monitor, isolated and controlled by
SW.
• The TOCTL (PM4388) is controlled by the MPC8260 via the address and data bus.
• The MPC8260TCOM board is powered and controlled by the MPC8260ADS via 2 x 128pin DIN
connectors.
1•3 SPECIFICATIONS
The MPC8260TCOM specifications are given in Table 1-1.
Table 1-1 MPC860SAR-PHY Specifications
CHARACTERISTICS SPECIFICATIONS
Power requirements (no other boards attached) +5Vdc @ 2 A (typical), 2.5 A (maximum)
Operating temperature 0 degrees to 30 degrees C ambient air temperature
Storage temperature -25 degrees to 85 degrees C
Relative humidity 5% to 90% (non-condensing)
Dimensions
Height
Depth
Thickness
9.17 inches (233 mm)
6.3 inches (160 mm)
0.063 inches (1.6 mm)
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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