February 2013
Page 9
1999-2013 © FRACTUS, S.A.
The TVNow
TM
dual band (UHF+Lband) DVB-H antenna should be assembled following either Sn-Pb or Pb-free
assembly processes. According to the Standard
IPC/JEDEC J-STD-020C
, the temperature profile suggested
is as follows:
Phase
Profile features
Pb-Free Assembly
(SnAgCu)
RAMP-UP
Avg. Ramp-up Rate (Ts
max
to Tp)
3 ºC / second (max.)
PREHEAT
-
Temperature Min (Ts
min
)
-
Temperature Max (Ts
max
)
-
Time (ts
min
to ts
max
)
150 ºC
200 ºC
60-180 seconds
REFLOW
-
Temperature (T
L
)
-
Total Time above T
L
(t
L
)
217 ºC
60-150 seconds
PEAK
-
Temperature (T
p
)
-
Time (tp)
260 ºC
20-40 seconds
RAMP-DOWN
Rate
6 ºC/second max.
Time from 25 ºC to Peak Temperature
8 minutes max.
Table 3
– Recommended soldering temperatures
Next graphic shows temperature profile (grey zone) for the antenna assembly process in reflow ovens.
Figure 5 –
Temperature profile
