USER MANUAL
Dual-band Reach Xtend
TM
(FR05-S1-NO-1-003)
Last updated on June 2017
© 2016 FRACTUS ANTENNAS, S.L. -
11
6.
ASSEMBLY PROCESS
Figure 6 shows the back and front view of the Dual-band Reach Xtend
TM
chip antenna, and
indicates the location of the feeding point and the mounting pads:
Figure 6
–
Pads of the Fractus Dual-band Reach Xtend
TM
chip antenna.
As a surface mount device (SMD), this antenna is compatible with industry standard soldering
processes. The basic assembly procedure for this antenna is as follows:
1.
Apply a solder paste to the pads of the PCB. Place the antenna on the board.
2.
Perform a reflow process according to the temperature profile detailed in Table 3, Figure 8
on page 12.
3.
After soldering the antenna to the circuit board, perform a cleaning process to remove any
residual flux. Fractus Antennas recommends conducting a visual inspection after the
cleaning process to verify that all reflux has been removed.
The drawing below shows the soldering details obtained after a correct assembly process:
Figure 7
–
Soldering Details.
NOTE(*):
Solder paste thickness after the assembly process will depend on the thickness of the
soldering stencil mask. A stencil thickness equal to or larger than
127 microns (5 mils)
is
required.
1
2
3
4
Antenna
PCB
Solder Paste
Antenna
PCB
~ 0.1* mm
1
1
3
Mounting Pads (2, 3 ,4)
: solder the antenna mounting pads to the
soldering pads on the PCB. These pads must NOT be grounded.
Feed Pad (1)
: the white circle on the top of the antenna indicates the position of the feed pad
in the bottom. Align the feed point with the feeding line on the PCB. See Figure 1.
