FLY FS501, Руководство по обслуживанию, Страница: 17 / 29

FLY SERVICE SUPPORT
3.1.7 I/O Interface
I/O Connector MICRO USB interface standard. Mainly used for software, download picture
messages 。
3.1.8 Display
The main screen is 5.0 inch
。
5.0-inch color screen FWVGA
3.2 Common Failure Analysis and Maintenance
Before cutting board after the completion of the production line SMT X-RAY inspection, according to the actual
situation, X-RAY examination can not be found 100% badness, X-RAY inspection may omissions some fault plate flow
down. If found fault plate in the testing process, the first step is to re-check of the X-RAY and carefully to see if there
is even welding, lap welding, Weld, if normal, analyze the situation following the positioning
。
3.2.1 Power failure Check
The failure phenomenon caused by a power failure: can not boot, shutdown leakage current boot large current.
The main reason for the problem: Weld, electrical the original filtering or ESD device to short-circuit, burning with the
device is connected to a power source.
Positioning as well as steps to solve this type of problem is as follows
：
1
，
Troubleshoot and connected to the power supply components of the welding, Weld, or the peripheral devices
even tin
。
2
，
with a multimeter rule out whether there is power to short-circuit, and step by step to troubleshoot the cause
of the short (mainly: even tin, IC burned ESD protection device breakdown, capacitor breakdown)
。
3
，
boot to test the power output is normal
。
If a power output value is not normal, whether the view filter capacitor welding problems, whether the
breakdown, filter capacitor is broken, replace; excluded one by one, and finally you can navigate to the main chip
damage
。
Each the power test position and the normal boot value is shown in the following table
VDDCORE 1.1V
VDDARM 1.2V
VDDMEM 1.2V