FLIR
LEPTON® Engineering Datasheet
The information contained herein does not contain technology as defined by the EAR, 15 CFR 772, is publicly available,
and therefore, not subject to EAR. NSR (6/14/2018).
Information on this page is subject to change without notice.
Lepton Engineering Datasheet, Document Number: 500-0659-00-09 Rev: 203
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Figure 42 - Illustration of Lepton Detector Time Constant
In addition to integrating signal current, the ROIC also digitizes and multiplexes the signal from each detector into
a serial stream. And the Lepton ROIC digitizes data from an on-chip temperature sensor as well as a thermistor
attached to the camera housing. An anti-reflection (AR) coated window is bonded above the sensor array via a
wafer-level packaging (WLP) process, encapsulating the array in a vacuum. The purpose of the vacuum is to
provide high thermal resistance between the microbolometer elements and the ROIC substrate, allowing for
maximum temperature change in response to incident radiation.
