L830-EA M.2 Module Hardware User Manual
Page 29 of 45
480Mbps. The following requirements should be followed in designing PCB layout.
USB_D+ and USB_D- signal lines should have the same length, and should be parallel; avoid right
angle wiring.
USB_D+ and USB_D- signal lines should be wrapped with GND at the ends.
USB2.0 differential signal line should be laid at the signal layer closest to the ground layer.
USB signal line shall be far away from stronger interference signal, such as power supply.
Ensure impedance matching; impedance is required to be 90ohm.
5.4.2 USB SSIC Interface
L830-EA M.2 wireless modules support USB Super Speed Inter-Chip
（
USB SSIC, achieve the high speed
transmission with low consumption between the chips, meet the high bandwidth transmission requires of
the 4G LTE and mobile network.
The definition of USB SSIC interface as listed below:
Pin#
Pin Name
I/O
Function Description
29
SSIC_TXN
O
USB SSIC Transmitter Signal N
，
connect SSIC_RXN in AP
side
31
SSIC_TXP
O
USB SSIC Transmitter Signal P
，
connect SSIC_RXP in AP
side
35
SSIC_RXN
I
USB SSIC Receiver Signal N
，
connect SSIC_TXN in AP side
37
SSIC_RXP
I
USB SSIC Receiver Signal P
，
connect SSIC_TXP in AP side
USB SSIC is the high-speed differential signal line, and their highest transmission rate is up to
5Gbps
.
The following requirements should be followed in designing PCB layout.
SSIC_TXN/ SSIC_TXP and SSIC_RXN/ SSIC_RXP are two differential signal lines, the routing
requires parallel and equal length, meanwhile, it requires to avoid right angle routing;
TX and RX signal lines should be wrapped with GND at the ends.
TX and RX signal lines require isolate.
The differential signal line should be laid at the signal layer closest to the ground layer.
Ensure impedance matching; impedance is required to be 100ohm.
5.5 USIM Interface
L830 M.2 series wireless modules support USIM and high speed SIM cards. But 8-line intelligent USIM is
not supported yet.
5.5.1 USIM Pins
Pin#
Pin Name
I/O
Function Description
