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CPC1302 User Manual
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Intended use of CPC1302
CPC1302
3.3 Possible heat removal options
Subsection 3.4 contains technical specifications, which the user should consider during
development of the proprietary cooling system. Heat-removal options are shown in the figure
below.
The side of the CPU of CPC1302 module is
equipped with the heat-spreading plate, to which
the heat from the CPU and PCH microchip is
withdrawn. With such a configuration, it is possible
to ensure heat dissipation by installing the module
immediately on the enclosure or chassis (the
enclosure fulfills a function of a large heatsink).
The module 1302 can be additionally equipped
with a heatsink from the set ACS30076-01 (to be
purchased as an option) or a user-made heatsink.
The heatsink is installed to the heatspreading
plate (using a thermal conductive paste) and is
fixed with the screws from the heatsink delivery
checklist.
CPC1302 can also be equipped with a heatsink
with a fan (set ACS30076-02, to be purchased as
an option).
Fig. 3-1: Possible heat removal options