Fairchild FPF2300 Скачать руководство пользователя страница 12

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FPF2300/02/03  •  Rev. 1.1.3

12

F

P

F2300/02/03 — Dual-Out

put Current Limit Switch

 

Figure 37. FPF2300 FLAGB While and Over-Current 

Condition is Applied

Note: 

7.

An over-current condition signal loads the output with a
heavy load current larger than I

LIMIT

 value.

Under-Voltage Lockout (UVLO)

The under-voltage lockout feature turns off the switch if the
input voltage drops below the under-voltage lockout threshold.
With the ON pin active (ON pin pulled LOW), the input voltage
rising above the under-voltage lockout threshold causes a
controlled turn-on of the switch and limits current overshoot. If a
device is in UVLO condition, both FLAGBs go LOW and indicate
the fault condition. The device detects the UVLO condition when
input voltage goes below UVLO voltage, but remains above
1.3V (typical). 

Reverse Current Blocking

Each switch of FPF2300/2/3 has an independent reverse
current blocking feature that protects input source against
current flow from output to input. For a standard USB power
design, this is an important feature that protects the USB host
from being damaged due to reverse current flow on V

BUS

. To

activate the reverse current blocking, the switch must be in OFF
state (ON pins inactivated) so that no current flows from the
output to the input. The FLAGB operation is independent of the
reverse current blocking and does not report a fault condition if
this feature is activated.

Thermal Shutdown

The thermal shutdown protects the device from internally or
externally generated excessive temperatures. Each switch has
an individual thermal shutdown protection function and operates
independently as adjacent switch temperatures increase above
140°C. If one switch is in normal operation and shutdown
protection of second switch is activated, the first channel
continues to operate if the affected channel's heat stays
confined. The over-temperature in one channel can shut down
both switches due to rapidly generated excessive load currents
resulting in very high power dissipation. Generally, a thermally
improved board layout can provide heat sinking and allow heat
to stay confined and not affect the second switch operation.

During an over-temperature condition, the FLAGB is pulled
LOW and the affected switch is turned off. If the temperature of
the die drops below the threshold temperature, the switch

automatically turns on again. To avoid unwanted thermal
oscillations, a 10°C (typical) thermal hysteresis is implemented
between thermal shutdown entry and exit temperatures.

If output of both switches are connected together and an
excessive load current activates thermal protection of both, the
controller can shut down the switches after both FLAGB outputs
go LOW and turn on both channels again. This provides
simultaneous switch turn on. Thermal protection is for  device
protection and should not be used as regular  operation.

Input Capacitor

To limit the voltage drop on the input supply caused by transient
inrush currents when the switch is turned on into discharged
load capacitors or a short-circuit; an input capacitor, C

IN

, is

recommended between IN and GND. The FPF2310/2/3/3L
features a fast current limit response time of 20

μ

s. An inrush

current (also known as surge current) could occur during the
current limit response time while the switch is responding to an
over-current condition caused by large output capacitors. A
10

μ

F ceramic capacitor, C

IN

, is required to provide charges for

the inrush current and prevent input voltage drop at turn on.
Higher values of C

IN

 can be used to further reduce voltage drop.

Output Capacitor

A 0.1

μ

F to 1

μ

F capacitor, C

OUT

, should be placed between the

OUT and GND pins. This capacitor prevents parasitic board
inductances from forcing output voltage below GND when the
switch turns off. This capacitor should have a low dissipation
factor. An X7R MLCC (Multilayer Ceramic Chip) capacitors is
recommended.

For the FPF2300 and FPF2302, the total output capacitance
needs to be kept below a maximum value, C

OUT(MAX)

, to

prevent the part from registering an over-current condition
beyond the blanking time and shutdown. The maximum output
capacitance for a giving input voltage can be determined from
the following:

For example, in a 5V application, C

OUT(MAX)

 can be determined

as:

VIN

ON

FLAGB

 

VOUT

Startup 

tBLANK

ILOAD

ILIMIT

Over 

current 

condtion

 

 

Thermal Shut

down

Devic

e C

ools O

ff

   (1)

C

OUT(MAX)

  =

I

LIM(MIN)

 x t

BLANK(MIN)

V

IN

   (2)

C

OUT(MAX)(IN = 5V)

  =

1.1A x 5ms

5

=

1.1mF

Содержание FPF2300

Страница 1: ...and pull the fault signal pin FLAGB LOW The FPF2300 has an auto restart feature that turns the switch on again after 504ms if the ON pin is still active For the FPF2303 a current limit condition immediately pulls the fault signal pin LOW and the part remains in the constant current mode until the switch current falls below the current limit For the FPF2300 through FPF2303 the current limit is typi...

Страница 2: ...pplication Functional Block Diagram Figure 4 Block Diagram ON OFF ONA IN GND FPF2300 2 3 FLAGB B OUTA TO LOAD A FLAGB A ON OFF ONB OUTB TO LOAD B CIN COUTB COUTA IN 1 8V 5 5V IN ONA ONB OUTA FLAGB A OUTB FLAGB B GND CURRENT LIMIT B THERMAL PROTECTION B CONTROL LOGIC B REVERSE CURRENT BLOCKING CURRENT LIMIT A THERMAL PROTECTION A CONTROL LOGIC A REVERSE CURRENT BLOCKING UVLO ...

Страница 3: ...ch B Active LOW 5 FLAGB B Fault Output B Active LO open drain output which indicates an over supply UVLO and thermal shutdown 6 OUTB Switch Output Output of the power switch B 7 OUTA Switch Output Output of the power switch A 8 FLAGB A Fault Output A Active LO open drain output which indicates an over supply UVLO and thermal shutdown 9 MLP Thermal Pad IC Substrate which can be connected to GND for...

Страница 4: ...sed on JEDEC STD 51 3 4 Soldered thermal pad on a four layer with two vias connected with GND plane base on JEDEC STD 51 5 7 Recommended Operating Range The Recommended Operating Conditions table defines the conditions for actual device operation Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications Fairchild does not recommend exceeding them ...

Страница 5: ...IN 1 8V 0 8 V IN 5 5V 1 4 VIL ON Input Logic Low Voltage IN 1 8V 0 5 V IN 5 5V 0 9 ION ON Input Leakage VON IN or GND 1 1 μA FLAGB Output Logic Low Voltage IN 5 5V ISINK 1mA 0 1 0 2 V IN 1 8V ISINK 1mA 0 15 0 30 FLAGB Output High Leakage Current IN VON 5V 1 μA Protections ILIM Current Limit IN 3 3V VOUTA VOUTB 3V TA 25 C 1 1 1 3 1 5 A TSD Thermal Shutdown Shutdown Threshold 140 C Return from Shutd...

Страница 6: ...VOLTA GE V ON RESISTANCE mOhms RO NA RO NB ONA O NB 0V IO UT 200m A TA 25 C Figure 10 RON vs Supply Voltage MLP Figure 11 RON vs Temperature SO8 Figure 12 RON vs Temperature MLP Figure 9 IN Shutdown Current vs Temperature Figure 7 Quiescent Current vs Supply Voltage Figure 8 Quiescent Current vs Temperature 0 00 10 00 20 00 30 00 40 00 50 00 60 00 70 00 40 15 10 35 60 85 TJ JUNCTIONTEM PERA TURE C...

Страница 7: ...Supply Voltage 0 0 0 3 0 5 0 8 1 0 1 3 1 5 1 8 2 2 2 5 2 9 3 3 3 7 4 0 4 4 4 8 5 1 5 5 SUPPLYVO LTA G E V ON THRESHOLD VOLTAGE V VIH VIL TA 25 C 0 0 0 2 0 4 0 6 0 8 1 0 1 2 40 15 10 35 60 85 TJ JUNCTIO NTEM PERA TURE C ON THRESHOLD VOLTAGE V IN 3 3V IN 5 5V IN 1 8V 0 0 0 2 0 4 0 6 0 8 1 0 1 2 40 15 10 35 60 85 TJ JUNCTIO NTEM PERA TURE C ON THRESHOLD VOLTAGE V IN 3 3V IN 5 5V IN 1 8V 1250 1260 127...

Страница 8: ...s Temperature Figure 19 tDON tDOFF vs Temperature Figure 20 tRISE tFALL vs Temperature 0 2 4 6 8 10 12 14 16 18 20 40 15 10 35 60 85 TJ JUNCTIO NTEM PERA TURE C RISE FALL TIME us tF tR IN 3 3V RL 500O hm s CL 0 1uF IN 3 3V RL 500O hm s 7 0 7 5 8 0 8 5 9 0 9 5 10 0 10 5 11 0 40 15 10 35 60 85 TJ JUNCTIO NTEM PERA TURE C OVER CURRENT BLANKING TIME ms FLAG B A FLAG B B FPF2300 2 IN 3 3V O NA O NB 0V ...

Страница 9: ...ut Capacitor Figure 30 Output Voltage at Startup with Different Output Capacitor Figure 27 Startup FLAGB Blanking Time FPF2303 Figure 25 tOFF Response Figure 26 Over Current Blanking Time FPF2300 2 Figure 28 Auto Restart Time FPF2300 2ms DIV OUT 5V DIV IN 5V COUT 10μF RL 2 8Ω ON 2V DIV FLAGB 2V DIV IOUT 1A DIV tBLANK 2ms DIV OUT 2V DIV COUT 10μF RL 3 3Ω ON 2V DIV FLAGB 2V DIV IOUT 1A DIV tSTART_BL...

Страница 10: ...g Capacitive Load Hot Plug In Event Figure 31 Current Limit Response Time Both Channels are in OC Figure 32 Startup FLAGB Blanking Time Figure 34 Inrush Response During Capacitive and Resistive Load Hot Plug In Event FLAGB B 2V DIV IN 5V ON 3 3V COUTA 100μF COUTB 100μF RLA RLB 1Ω IN 5V DIV ON 2V DIV 10ms DIV FLAGB A 2V DIV OUT 5V DIV IN 5V COUT 47μF CL 470μF RL 5Ω IN 5V DIV ON 5V DIV 1ms DIV IOUT ...

Страница 11: ...ng time of 10ms typical during which the switch acts as a constant current source At the end of the blanking time the switch is turned off The FPF2303 has no current limit blanking period so it remains in a constant current state until the ON pin of the affected switch is deactivated or the thermal shutdown turns off the switch Fault Reporting Over current input under voltage and over temperature ...

Страница 12: ...w heat to stay confined and not affect the second switch operation During an over temperature condition the FLAGB is pulled LOW and the affected switch is turned off If the temperature of the die drops below the threshold temperature the switch automatically turns on again To avoid unwanted thermal oscillations a 10 C typical thermal hysteresis is implemented between thermal shutdown entry and exi...

Страница 13: ...B ports can be imple mented with a single FPF230X part and current limiting is pro vided based on a two port basis for a cost effective solution Figure 39 Individual Port Power Management for Self Powered 4 Port USB Hub In Figure 39 each USB port is connected with each output Four USB ports can be implemented with two FPF230X parts Current limiting and control are provided based on a single port C...

Страница 14: ...mum power dissipation occurs when the output of switch is shorted to ground For the FPF2300 the power dissipation scales with the auto restart time tRSTRT and the over current blanking time tBLANK In this case the maximum power dissipated for the FPF2300 is which results in Note that this is below the maximum package power dissipation and the thermal shutdown feature protection provides additional...

Страница 15: ... These techniques are listed in order of the significance of impact 1 Thermal performance of the load switch can be improved by connecting the DAP Die Attach Pad of MLP 3x3mm package to the GND plane of the PCB 2 Embedding two exposed through hole vias into the DAP pin 9 provides a path for heat to transfer to the back GND plane of the PCB A drill size of round 15 mils 0 4mm with 1 ounce copper pl...

Страница 16: ...te of the each channel can be configured using J1 and J2 jumpers In addition both channels can be controlled by ONA and ONB test pints Thermal performance of the board is improved using techniques in the layout recommendations section R3 and R4 resistors are used on the board to sink a light load current when switches are activated Figure 43 Top SST and AST Layers MLP 3x3mm and SO8 Figure 44 Botto...

Страница 17: ...Drawings may change in any manner without notice Please note the revision and or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision Package specifications do not expand the terms of Fairchild s worldwide terms and conditions specifically the warranty therein which covers Fairchild products Always visit Fairchild Semiconductor s onl...

Страница 18: ...ponents Drawings may change in any manner without notice Please note the revision and or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision Package specifications do not expand the terms of Fairchild s worldwide terms and conditions specifically the warranty therein which covers Fairchild products Always visit Fairchild Semiconduct...

Страница 19: ...M TinyWire TriFault Detect TRUECURRENT μSerDes UHC Ultra FRFET UniFET VCX VisualMax XS Datasheet Identification Product Status Definition Advance Information Formative In Design Datasheet contains the design specifications for product development Specifications may change in any manner without notice Preliminary First Production Datasheet contains preliminary data supplementary data will be publis...

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