www.ezurio.com
DSH_BT024-00200_1v4 © Ezurio Ltd 2006
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Notes: The motherboard should have no copper, solder resist or tracks beneath the module on the pad layer.
N/C Pins should have no electrical connection, including to other N/C pins, but be mechanical pads only.
11.
Qualification
11.1
Bluetooth
Qualification Process
The following safety precautions must be observed during all phases of the operation, usage, service or repair of
any application incorporating this Module. Manufacturers of the RF equipment are advised to convey the following
safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied
with the product. Failure to comply with these precautions violates safety standards of design, manufacture and
intended use of the product. Ezurio assumes no liability for customer failure to comply with these precautions.
11.2
Safety Information:
Switch off the
Bluetooth
device before boarding an aircraft. Make sure it cannot be switched on inadvertently. The
operation of wireless appliances in an aircraft is forbidden by many airlines to prevent interference with
communications systems. Applications that could result in use on aircraft should carry appropriate warnings.
11.3
Qualifications
11.3.1
RF approvals
The Module is listed as a
Bluetooth
Product in terms of the
Bluetooth
SIG Program Reference Document (PRD).
This means that it can be integrated into end products without further testing or approval listing. The
manufacturer must state the Ezurio part number and product reference in his literature in order to meet the
requirements of the
Bluetooth
and regulatory approvals.
A list of the countries where the Module is approved will be provided by Ezurio as required. As a minimum the
product is listed in Europe, Scandinavia and USA. Ezurio assumes no liability for customer failure to comply with
national RF approvals.