X
X
R
R
P
P
6
6
1
1
4
4
1
1
3
3
5
5
A
A
S
S
y
y
n
n
c
c
h
h
r
r
o
o
n
n
o
o
u
u
s
s
S
S
t
t
e
e
p
p
D
D
o
o
w
w
n
n
C
C
O
O
T
T
C
C
o
o
n
n
t
t
r
r
o
o
l
l
l
l
e
e
r
r
© 2013 Exar Corporation
2/7
Rev. 1.0.0
PIN ASSIGNMENT
Fig. 2: XRP6141 Pin Assignment
PIN DESCRIPTION
Name
Pin Number
Description
GL
1
Driver output for Low-side N-channel synchronous MOSFET.
NC
2
Internally not connected. Leave this pin floating.
SW
3
Lower supply rail for high-side gate driver GH. Connect this pin to the junction between
the two external N-channel MOSFETs.
GH
4
Driver output for high-side N-channel switching MOSFET.
BST
5
High-side driver supply pin. Connect a 0.1uF bootstrap capacitor between BST and SW.
ILIM
6
Over-current protection programming. Connect with a resistor to the Drain of the low-
side MOSFET.
EN/MODE
7
Precision enable pin. Pulling this pin above 1.9V will turn the IC on and it will operate in
Forced CCM. If the voltage is raised above 3.0V then the IC will operate in DCM or CCM
depending on load.
TON
8
Constant on-time programming pin. Connect with a resistor to AGND.
SS
9
Soft-Start pin. Connect an external capacitor between SS and AGND to program the
soft-start rate based on the 10uA internal source current.
PGOOD
10
Power-good output. This open-drain output is pulled low when V
OUT
is outside the
regulation.
FB
11
Feedback input to feedback comparator. Connect with a set of resistors to VOUT and
GND in order to program V
OUT
.
AGND
12, 13
Analog ground. Control circuitry of the IC is referenced to this pin.
VIN
14
IC supply input. Provides power to internal LDO.
VCC
15
The output of LDO. For operation using a 5V rail, VCC should be shorted to VIN.
PGND
16
Ground for low side driver
Exposed Pad
Thermal pad for heat dissipation. Connect to AGND with a short trace.
ORDERING INFORMATION
Refer to XRP6141’s datasheet and/or
1
2
3
4
5
6
7
8
9
13
14
15
10
12
16
11
GL
NC
SW
GH
BST
ILIM
EN
TON
SS
PGOOD
FB
AGND
AGND
VIN
PGND VCC
EXPOSED PAD
