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Installing the Product
M60 SERIES
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2. Low space -Y > L: below the PC, there should be a space at least the same size as
the largest dimension of the PC;
3. There should be at least 0.5L space for the other four directions (front, rear, left,
right);
4. In the above heat exchange areas, there should be no other heat generating object or
space divider, and no other article is allowed to be placed on the surface of chassis;
5. There should be heat exchange channel between heat exchange area and outside
natural environment, such as air moving equipment, and air inlet/outlet to ensure air
circulation, etc.;
6. The temperature of lower space (20
~
50mm from the bottom of the PC) should be
no more than the rated operating environment temperature of the PC;
7. At any point in the heat exchange area, the air flow speed should not be lower than
0.2m/s.
Picture 1 Largest dimensions of the PC
Picture 2 Heat exchange area
Содержание M60 Series
Страница 1: ...M60 SERIES Fanless modular complete PC Version C00 ...
Страница 11: ...Product Introduction 2 M60 SERIES M60 E 01 M60 E 2P 01 M60 H 2P 01 ...
Страница 50: ...BIOS Setup Applicable to M60 E family models M60 SERIES 41 Advanced Super IO Configuration ...
Страница 113: ...Dimensions Drawing 104 M60 SERIES 240 185 269 5 185 57 5 5 3 6 E M60 01 240 185 258 5 113 5 122 185 M60 E 2P 01 ...
Страница 116: ...Dimensions Drawing M60 SERIES 107 125 133 5 240 185 258 5 70 140 4 5 185 M60 H 2P 01 Unit mm ...